X-On Electronics has gained recognition as a prominent supplier of M38510/10107BGA(LTC) across the USA, India, Europe, Australia, and various other global locations. M38510/10107BGA(LTC) are a product manufactured by E2v. We provide cost-effective solutions for M38510/10107BGA(LTC), ensuring timely deliveries around the world.

M38510/10107BGA(LTC) E2v

M38510/10107BGA(LTC) electronic component of E2v
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See Product Specifications
Part No. M38510/10107BGA(LTC)
Manufacturer: E2v
Category: Unclassified
Description: LM118 CAN LTC DIE
Small programmable logic IC with 20Kb memory, 256 Macrocells and 369 pins in BGA package.
Datasheet:
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 1769.1729 ea
Line Total: USD 1769.17 
Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Fri. 07 Mar to Thu. 13 Mar
MOQ : 1
Multiples : 1
1 : USD 1769.1729
10 : USD 1486.1039
25 : USD 1188.8873

   
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We are delighted to provide the M38510/10107BGA(LTC) from our E2v manufacturer, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the M38510/10107BGA(LTC) and other electronic components in the E2v manufacturer and beyond.

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M38510/10107BGA(LTC) is a MIL-STD-835F qualified Leadless Chip Carrier (LTC) package from E2v. It is a ball grid array package that includes a ball array arrangement, typically of 107 pins and 0.5 mm pitch, in a 52.5 mm x 53.5 mm square body. This package offers good electrical, thermal, mechanical and environmental performance. The package has an average body thickness of 1.6 mm, making it suitable for a wide range of new applications. The hermetic sealing gives excellent protection against shock, vibrations and corrosion. The package is ideal for use in high reliability military and aerospace applications, and is RoHS compatible.

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