INCH-POUND MIL-M-38510/350A 26 May 2004 SUPERSEDING MIL-M-38510/350 24 June 1985 MILITARY SPECIFICATION MICROCIRCUITS, DIGITAL, BIPOLAR, ADVANCED SCHOTTKY TTL, QUAD 2-PORT REGISTERS, CASCADABLE, MONOLITHIC SILICON Reactivated after 26 May 2004 and may be used for either new or existing design acquisition. This specification is approved for use by all Departments and Agencies of the Department of Defense. The requirements for acquiring the product herein shall consist of this specification sheet and MIL-PRF 38535 1. SCOPE 1.1 Scope. This specification covers the detail requirements for monolithic silicon, advanced Schottky TTL, quad 2-port register microcircuits. Two product assurance classes and a choice of case outlines and lead finishes are provided for each type and are reflected in the complete part number. For this product, the requirements of MIL-M- 38510 have been superseded by MIL-PRF-38535, (see 6.3). 1.2 Part or Identifying Number (PIN). The PIN is in accordance with MIL-PRF-38535, and as specified herein. 1.2.1 Device types. The device types are as follows: Device type Circuit 01 Quad 2-port cascadable register with both inverted and non-inverted outputs 02 Quad 2-port cascadable register with non-inverted outputs 1.2.2 Device class. The device class is the product assurance level as defined in MIL-PRF-38535. 1.2.3 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line F GDFP2-F16 or CDFP3-F16 16 Flat pack R GDIP1-T20 or CDIP2-T20 20 Dual-in-line S GDFP2-F20 or CDFP3-F20 20 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier Comments, suggestions, or questions on this document should be addressed to: Commander, Defense Supply Center Columbus, ATTN: DSCC-VAS, P. O. Box 3990, Columbus, OH 43218-3990, or emailed to bipolar dscc.dla.mil. Since contact information can change, you may want to verify the currency of this address information using the ASSIST Online database at www.dodssp.daps.mil. AMSC N/A FSC 5962 MIL-M-38510/350A 1.3 Absolute maximum ratings. Supply voltage range ............................................................................. -0.5 V dc to +7.0 V dc Input voltage range ................................................................................ -1.2 V dc at -18 mA to +7.0 V dc Storage temperature range .................................................................... -65 to +150C Maximum power dissipation, per device (P ) 1/ D Device type 01 ................................................................................. 209 mW Device type 02 ................................................................................. 187 mW Lead temperature (soldering, 10 seconds) ............................................. +300C Thermal resistance, junction to case ( ) .............................................. (See MIL-STD-1835) JC Junction temperature (T ) 2/ ................................................................... 175C J 1.4 Recommended operating conditions. Supply voltage (V ) .............................................................................. 4.5 V dc minimum to 5.5 V dc CC maximum Minimum high level input voltage (V ) ................................................... 2.0 V dc IH Maximum low level input voltage (V ) .................................................... 0.8 V dc IL Normalized fanout (each output) 3/ : Low level .......................................................................................... 33 maximum High level ......................................................................................... 50 maximum Case operating temperature range (T ) ................................................. -55 to +125C C Width of clock pulse high: Device type 01, 02 ........................................................................... 4.0 ns minimum Width of clock pulse low: Device type 01, 02 ........................................................................... 7.0 ns minimum Setup time in high to clock pulse: Device type 01, 02 ........................................................................... 4.5 ns minimum Setup time in low to clock pulse: Device type 01, 02 ........................................................................... 4.5 ns minimum Setup time S high to clock pulse: Device type 01 ................................................................................. 10.5 ns minimum Device type 02 ................................................................................. 9.5 ns minimum Setup time S low to clock pulse: Device type 01 ................................................................................. 10.5 ns minimum Device type 02 ................................................................................. 9.5 ns minimum Hold time in high to clock pulse: Device type 01, 02 ........................................................................... 1.5 ns minimum Hold time in low to clock pulse: Device type 01, 02 ........................................................................... 1.5 ns minimum Hold time S high to clock pulse: Device type 01, 02 ........................................................................... 0 ns minimum Hold time S low to clock pulse: Device type 01, 02 ........................................................................... 0 ns minimum 2. APPLICABLE DOCUMENTS 2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification. This section does not include documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements of documents cited in sections 3, 4, or 5 of this specification, whether or not they are listed. 1/ Must withstand the added P due to short-circuit test (e.g., I ). D OS 2/ Maximum junction temperature should not be exceeded except in accordance with allowable short duration burn-in screening condition in accordance with MIL-PRF-38535. 3/ The device should fanout in both high and low levels to specified number of inputs of the same device type as that being tested. 2