Effective June 2019 Technical Data 4373 Supersedes September 2017 FP0404 High frequency, high current power inductors Applications Multi-phase and Vcore regulators Voltage Regulator Modules (VRMs) Server and desktop VRMs and EVRDs Laptop and notebook regulators Data networking and storage systems Graphics cards and battery power systems Point-of-Load modules Environmental data Storage temperature range (component): Product features -40 C to +125 C High current carrying capacity Operating temperature range: -40 C to +125 C Low core loss (ambient plus self-temperature rise) DC-DC converter applications up to 2 MHz Solder reflow temperature: J-STD-020 (latest revision) compliant Filtering applications see inductance vs fre- quency and impedance vs frequency curves on HALOGEN page 5 HF Pb Inductance Range from 22 nH to 170 nH FREE Current range up to 40 A 4.0 mm x 4.0 mm footprint surface mount package in 3.0 mm and 4.0 mm heights Moisture sensitivity level (MSL): 1 Ferrite core materialTechnical Data 4373 FP0404 Effective June 2019 High frequency, high current power inductors Product specifications DCR (m) 3 4 5 6 1 2 I I I I OCL FLL 1 2 3 +20 C rms sat sat sat 5 7 Part number (nH) 15% (nH) minimum (A) (A) (A) (A) 25% K-factor FP0404R1-R022-R 22 20% 15 40 40 34 32 0.32 15% 2351 FP0404R1-R065-R 65 44 40 24 22 20 0.32 2248 FP0404R1-R080-R 80 54 40 19.5 18 16 0.32 2248 FP0404R1-R100-R 100 68 40 15.6 14 13 0.32 2248 FP0404R1-R110-R 110 74.5 40 14.2 13 11.8 0.32 2248 FP0404R1-R170-R 170 116 40 9.0 7.8 7.6 0.32 2248 1. Open Circuit Inductance (OCL) Test parameters: 100 kHz (1 MHz for R022), 0.1 Vrms, 0.0 Adc, +25 C 4. I 1 : Peak current for approximately 20% rolloff +25 C sat 2. Full Load Inductance (FLL) Test parameters: 100 kHz (1 MHz for R022), 0.1 Vrms, I 1, +25 C 5. I 2 : Peak current for approximately 20% rolloff +100 C sat sat 3. I : DC current for an approximate temperature rise of 40 C without core loss. Derating is necessary for AC currents. 6. I 3 : Peak current for approximately 20% rolloff +125 C rms sat -3 PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the 7. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * I * 10 . Bp-p:(Gauss), K: (K-factor from temperature rise. It is recommended that the temperature of the part not exceed +125 C underworst case operating table), L: (Inductance in nH), I (Peak to peak ripple current in Amps). conditions verified in the end application. 8. Part Number Definition: FP0404Rx-Rxxx-R FP0404 = Product code and size Rx= DCR indicator Rxxx=Inductance value in H, R=decimal point -R suffix = RoHS compliant Dimensions (mm) 4.0 max 1 Part number C max 4.0 max R022-R 3.0 R065-R 4.0 2 R080-R 4.0 (R065, R080, R100, R110) (R022) Recommended Pad Layout R100-R 4.0 4.3 R110-R 4.0 1.7 R170-R 4.0 4.2 1.7 0.9 1.9 Schematic 1.2 1.2 1.4 1.4 0.20 0.20 1 0.20 0.20 1.4 1.4 0.30 0.30 2 Part marking: Rxxx xxx=inductance value in uH, R=decimal point, wly= date code All soldering surfaces to be coplanar within 0.1 millimeters DCR is measured from point a to point b Do not route traces or vias underneath the inductor 2 www.eaton.com/electronics
