Technical Data 10408 Effective June 2015 FP1008R1 and FP1008R2 High frequency, high current power inductors Applications Servers Multi-phase and Vcore regulators Voltage Regulator Modules (VRMs) Desktop VRMs and EVRDs Data networking and storage systems Graphics cards and battery power systems Point-of-Load modules DCR Sensing circuits Environmental data Storage temperature range (Component): -40C to +125 C Operating temperature range: -40C to +125C (ambient + self-temperature rise) Solder reflow temperature: J-STD-020D compliant Product description High current carrying capacity HALOGEN Low core loss HF Pb FREE Controlled DCR for sensing circuits Inductance range from 120nH to 300nH Current range from 38 to 112 amps 10.8 x 8.0 mm footprint surface mount package in an 8.0 mm height Ferrite core material Halogen free, lead free, RoHS compliantFP1008R1 and FP1008R2 Technical Data 10408 Effective June 2015 High frequency, high current power inductors Product specifications 1 2 3 4 5 6 OCL FLL I I 1 I 2 I 3 DCR (m ) rms sat sat sat 9 7 Part Number (nH)10% (nH) minimum (amps) (amps) (amps) (amps) 5% 20C K-factor R1 version FP1008R1-R120-R 120 86 79 112 92 84 0.17 342 FP1008R1-R150-R 150 108 79 90 72 67 0.17 342 FP1008R1-R180-R 180 130 79 74 60 54 0.17 342 FP1008R1-R220-R 220 158 79 56 44 42 0.17 342 FP1008R1-R270-R 270 194 79 44 34 32 0.17 342 FP1008R1-R300-R 300 216 79 38 30 28 0.17 342 R2 version FP1008R2-R120-R 120 86 74 112 92 84 0.18 342 FP1008R2-R150-R 150 108 74 90 72 67 0.18 342 FP1008R2-R180-R 180 130 74 74 60 54 0.18 342 FP1008R2-R220-R 220 158 74 56 44 42 0.18 342 FP1008R2-R270-R 270 194 74 44 34 32 0.18 342 FP1008R2-R300-R 300 216 74 38 30 28 0.18 342 1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.1V , 0.0Adc, +25C 7. K-factor: Used to determine B for core loss (see graph). rms p-p -3 2. Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1V , I 1, +25C B = K * L * I * 10 . B :(Gauss), K: (K-factor from table), rms sat p-p p-p 3. I : DC current for an approximate temperature rise of 40C without core loss. Derating is necessary L: (Inductance in nH), I (Peak-to-peak ripple current in Amps). rms for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating 8. Part Number Definition: FP1008Rx-Rxxx-R components will affect the temperature rise. It is recommended that the temperature of the part FP1008 R= Product code and size not exceed 125C under worst case operating conditions verified in the end application. x = DCR indicator 4. I 1: Peak current for approximately 20% rolloff +25C Rxxx = Inductance value in H, R = decimal point sat 5. I 2: Peak current for approximately 20% rolloff +100C - R suffix = RoHS compliant sat 6. I 3: Peak current for approximately 20% rolloff +125C sat Dimensions (mm) Recommended Pad Layout Schematic 3.0 2.5 a FP1008Rx 10.8 4.06 5.0 Rxxx 0.2 max wwllyy R min 3.56 2.5 b 8.0 max 8.0 max Part marking: FP1008Rx (x= DCR indicator), Rxxx (xxx=inductance value in uH, R=decimal point), wwllyy = date code, R = revision level Tolerances are 0.15 millimeters unless stated otherwise PCB tolerances are 0.1 millimeters unless stated otherwise All soldering surfaces to be coplanar within 0.1 millimeter DCR measured from point a to point b Do not route traces or vias underneath the inductor www.eaton.com/elx 2