Technical Data 10520 Effective April 2017 FP1008R5 and FP1008R6 High frequency, high current power inductors Applications Multi-phase and Vcore regulators Voltage Regulator Modules (VRMs) and high power density VRMs Server and desktop Central processing unit (CPU) Graphics processing unit (GPU) Application specific integrated circuit (ASIC) Data networking and storage systems Graphics cards and battery power systems Point-of-Loadmodules (POL) DCR sensing circuits Product features Environmental data High current carrying capacity Storage temperature range (Component): -40 C to +125 C Low core loss Operating temperature range: -40 C to +125 C Magnetically shielded (ambient plus self-temperature rise) Tight tolerance DCR for sensing circuits Solder reflow temperature: Inductance Range from 100 nH to 300 nH J-STD-020 (latest revision) compliant Current range from 36 A to 103 A Halogen free, lead free, RoHS compliant 10.8 mm x 8.0 mm footprint surface mount package in an 8.0 mm height HALOGEN Moisture Sensitivity Level: 1 HF Pb FREE Ferrite core materialFP1008R5 and FP1008R6 Technical Data 10520 Effective April 2017 High frequency, high current power inductors Product specifications 1 2 3 4 5 6 OCL FLL I I 1 I 2 I 3 DCR (m) rms sat sat sat 8 7 Part Number (nH) 10% (nH) minimum (A) (A) (A) (A) 5% 20 C K-factor R5 version FP1008R5-R120-R 120 86 79 103 90 84 0.170 342 FP1008R5-R150-R 150 108 79 85 68 64 0.170 342 FP1008R5-R180-R 180 130 79 70 56 53 0.170 342 FP1008R5-R220-R 220 158 79 58 44 42 0.170 342 FP1008R5-R270-R 270 194 79 44 34 32 0.170 342 FP1008R5-R300-R 300 216 79 36 28 26 0.170 342 R6 version FP1008R6-R100-R 100 72 74 103 86 81 0.180 342 FP1008R6-R120-R 120 86 74 103 90 84 0.180 342 FP1008R6-R150-R 150 108 74 85 68 64 0.180 342 FP1008R6-R180-R 180 130 74 70 56 53 0.180 342 FP1008R6-R220-R 220 158 74 58 44 42 0.180 342 FP1008R6-R270-R 270 194 74 44 34 32 0.180 342 FP1008R6-R300-R 300 216 74 36 28 26 0.180 342 1. Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 0.1 Vrms, 0.0 Adc, +25 C 6. I 3: Peak current for approximately 20% rolloff +125 C sat 2. Full Load Inductance (FLL) Test Parameters: 100 kHz, 0.1 V , I 1, +25 C 7. K-factor: Used to determine B for core loss (see graph). p-p rms sat -3 3. I : DC current for an approximate temperature rise of 40 C without core loss. Derating is B = K * L * I * 10 . B :(Gauss), K: (K-factor from table), L: rms p-p p-p necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of (Inductance in nH), I (Peak to peak ripple current in Amps). other heat generating components will affect the temperature rise. It is recommended that the 8. Part Number Definition: FP1008Rx-Rxxx-R temperature of the part not exceed 125 C under worst case operating conditions verified in the FP1008R= Product code and size end application. x= Version indicator 4. I 1: Peak current for approximately 20% rolloff +25 C -Rxxx= Inductance value in uH, R= decimal point sat 5. I 2: Peak current for approximately 20% rolloff +100 C -R suffix = RoHS compliant sat Dimensions (mm) Part marking: FP1008Rx (x = Version), Rxxx= Inductance value in uH (R= decimal point) xxxx = Lot code Tolerances are 0.15 millimeters unless stated otherwise Pad layout tolerances are 0.1 millimeters unless stated otherwise All soldering surfaces to be coplanar within 0.1 millimeter DCR measured from point A to point B Do not route traces or vias underneath the inductor www.eaton.com/electronics 2