Effective June 2020 Technical Data 4342 Supersedes June 2017 FP1107R High frequency, high current power inductors Applications Multi-phase and Vcore regulators Voltage Regulator Modules (VRMs) Server and desktop Central processing unit (CPU) Graphics processing unit (GPU) Application specific integrated circuit (ASIC) High power density Data networking and storage systems Graphics cards and battery power systems Point-of-load modules DCR Sensing circuits Environmental compliance and general specifications Product features Storage temperature range (Component): High current carrying capacity -40 C to +125 C Low core loss, magnetically shielded Operating temperature range: -40 C to +125 C Tight tolerance DCR for sensing circuits (ambient plus self-temperature rise) Magnetically shielded Solder reflow temperature: J-STD-020 (latest revision) compliant Inductance range from 70 nH to 510 nH Current range from 42 A to 140 A HALOGEN Frequency range up to 2 MHz HF Pb 11 mm x 7.2 mm and 11.2 mm x 8.0 mm FREE footprint surface mount package in 6.5 mm, 7.2 and 7.5 mm heights Ferrite core material Moisture sensitivity level (MSL): 1Technical Data 4342 FP1107R Effective June 2020 High frequency, high current power inductors Product Specifications 1 2 3 4 5 6 7 OCL FLL (nH) I I 1 I 2 I 3 I 4 DCR (m) rms sat sat sat sat 9 8 Part number (nH) 10% minimum (A) (A) (A) (A) (A) +20C K-factor R1 version FP1107R1-R07-R 70 50 55 140 na na 123 0.29 8% 361.1 FP1107R1-R12-R 120 86 55 90 na na 72 0.29 8% 361.1 FP1107R1-R15-R 150 108 55 70 na na 56 0.29 8% 361.1 FP1107R1-R23-R 230 166 55 45 na na 36 0.29 8% 361.1 FP1107R1-R30-R 300 217 55 35 na na 28 0.29 8% 361.1 FP1107R1-R40-R 400 288 55 25 na na 20 0.29 8% 361.1 FP1107R1-R51-R 510 364 55 18 na na 14.5 0.29 8% 361.1 R2 version FP1107R2-R07-R 70 50 42 140 na na 123 0.47 6.4% 363.3 FP1107R2-R12-R 120 86 42 90 na na 72 0.47 6.4% 363.3 FP1107R2-R15-R 150 108 42 70 na na 56 0.47 6.4% 363.3 FP1107R2-R23-R 230 166 42 45 na na 36 0.47 6.4% 363.3 FP1107R2-R30-R 300 217 42 35 na na 28 0.47 6.4% 363.3 FP1107R2-R40-R 400 288 42 25 na na 20 0.47 6.4% 363.3 FP1107R2-R51-R 510 364 42 18 na na 14.5 0.47 6.4% 363.3 R4 version FP1107R4-R180-R 180 130 50 62 55 53 50 0.29 5% 361 R5 version FP1107R5-R070-R 70 50 55 140 na na 123 0.29 5% 361.1 FP1107R5-R120-R 120 86 55 90 na na 72 0.29 5% 361.1 FP1107R5-R150-R 150 108 55 70 na na 56 0.29 5% 361.1 FP1107R5-R230-R 230 166 55 45 na na 36 0.29 5% 361.1 FP1107R5-R300-R 300 217 55 35 na na 28 0.29 5% 361.1 FP1107R5-R400-R 400 288 55 25 na na 20 0.29 5% 361.1 FP1107R5-R510-R 510 364 55 18 na na 14.5 0.29 5% 361.1 1 1. Open circuit inductance (OCL) Test parameters: 100 kHz, 0.1 Vrms, 0.0 Adc, +25 C 4. I : Peak current for approximately 20% rolloff +25 C sat 2 2. Full load inductance (FLL) Test parameters: 100 kHz, 0.1 Vrms, Isat1, +25 C 5. I : Peak current for approximately 20% rolloff +85 C sat 3 3. I : DC current for an approximate temperature rise of 40 C without core loss. Derating is necessary for AC currents. 6. I : Peak current for approximately 20% rolloff +100 C rms sat 4 PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the 7. I : Peak current for approximately 20% rolloff +125 C sat -3 temperature rise. It is recommended that the temperature of the part not exceed +125 C under worst case operating 8. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * I * 10 . Bp-p:(Gauss), conditions verified in the end application. K: (K-factor from table), L: (Inductance in nH), Symbol I (Peak to peak ripple current in Amps). 9. Part Number Definition: FP1107Rx-Rxxx-R FP1107R= Product code and size x= Version indicator -Rxxx= Inductance value in H, R= decimal point -R suffix = RoHS compliant 2 www.eaton.com/electronics