Effective September 2017 Technical Data 10227 Supersedes April 2014 FP1108R High frequency, high current power inductors Applications Multi-phase regulators Voltage Regulator Modules (VRMs) Desktop and server VRMs and EVRDs Notebook and laptop regulators Data networking and storage systems Graphics cards and battery power systems Point-of-Load modules DCR Sensing circuits Environmental data Storage temperature range (component): -40 C to +125 C Product features Operating temperature range: -40 C to +125 C 11.0 mm x 8.0 mm x 7.5 mm surface mount (ambient plus self-temperature rise) package Solder reflow temperature: Ferrite core material J-STD-020 (latest revision) compliant Tight tolerance DCR for sensing circuits HALOGEN Inductance range from 100 nH to 210 nH Pb HF Current range from 55 A to 100+ A FREEFP1108R Technical Data 10227 Effective September 2017 High frequency, high current power inductors Product specifications 1 2 3 4 5 6 7 OCL FLL min. I I 1 I 2 I 3 I 4 DCR rms sat sat sat sat 9 8 Part Number (nH) 10% (nH) (A) K-factor (A) (A) (m) +20 C (A) (A) FP1108R1-R10-R 100 81 100+ 96 94 90 330 FP1108R1-R15-R 150 110 77 72 66 63 330 65 0.295% FP1108R1-R18-R 180 132 65 61 58 50 330 FP1108R1-R21-R 210 151 55 51 48 45 330 1. Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 0.1 V , 6. Isat3 : Peak current for approximately 20% (R10 10%) rolloff +100 C rms 0.0 Adc, +25 C 7. Isat4: Peak current for approximately 20% (R10 10%) rolloff +125 C 2. Full Load Inductance (FLL) Test Parameters: 100 kHz, 0.1 V , I 1, +25 C 8. K-factor: Used to determine B for core loss (see graph). B = K * L * I. rms sat p-p p-p 3. I : DC current for an approximate temperature rise of 40 C without core B :(Gauss), K: (K-factor from table), L: (Inductance in H), rms p-p loss. Derating is necessary for AC currents. PCB layout, trace thickness and I (peak to peak ripple current in amps). width, air-flow, and proximity of other heat generating components will affect 9. Part Number Definition: FP1108Rx-yyy-R the temperature rise. It is recommended that the temperature of the part not - FP1108Rx = Product code and size exceed +125 C under worst case operating conditions verified in the end - Rx = DCR indicator application. - yyy= Inductance value in H 4. I 1 : Peak current for approximately 20% (R10 10%) rolloff - -R suffix = RoHS compliant sat +25 C (R10 10%) 5. I 2: Peak current for approximately 20% (R10 10%) rolloff +85 C sat Dimensions - mm Schematic Top View Recommended Pad Layout Side View Bottom View 7.7 2.1 B +0.3/-0.2 0.2 FP1108R1 0.2 10.7 6.7 xxx typ. 11.4 0.3 typ. wwllyy R 2.0 3.10 (2x) 0.2 A 2.50 (2x) Front View DCR measured from point A to point B Part marking: FP1108R1 (Product code and size), xxx = Inductance value in H, wwllyy= date code, R= revision level 7.5 Tolerances are 0.15 millimeters unless stated otherwise max PCB tolerances are 0.1millimeters unless otherwise specified. All soldering surfaces to be be coplanar within 0.1 millimeters. Termination finish: matte Sn with Ni underplate Do not route traces or vias underneath inductor Packaging information - mm 1.5 dia 1.75 4.0 A 2.0 11.5 FP1108R1 24 xxx 0.3 11.2 wwllyy R 7.7 8.2 A 16.0 1.5 dia User Direction of Feed Section A-A Supplied in tape and reel packaging, 500 parts per 13 diameter reel, www.eaton.com/electronics 2