Effective June 2017 Technical Data 4355 Supersedes March 2012 FP1308R High frequency, high current power inductors Applications Multi-phase regulators Voltage Regulator Module (VRM) Desktop and server VRMs and EVRDs Data networking and storage systems Graphics cards and battery power systems Point-of-load modules DCR sensing Environmental data SMD Device Storage temperature range (component): -40 C to +125 C Product features Operating temperature range: -40 C to +125 C 13.4 x 12.7 x 8.0mm surface mount package (ambient plus self-temperature rise) Ferrite core material Solder reflow temperature: High current carrying capacity, Low core losses J-STD-020 (latest revision) compliant Controlled DCR tolerance for sensing circuits HALOGEN Inductance range from 110nH to 440nH Pb HF Current range from 37 to 120 Amps FREE Frequency range up to 2MHzFP1308R Technical Data 4355 Effective June 2017 High frequency, high current power inductors Product Specifications 1 2 3 4 5 Part OCL FLL I I 1 I 2 DCR (m) rms sat sat 7 6 Number 10% (nH) (nH) (Amps) 25C (Amps) 125C (Amps) 20C K-factor R1 Version FP1308R1-R11-R 110 79 120 105 233 FP1308R1-R21-R 210 152 80 68 233 FP1308R1-R26-R 260 187 57 64 52 0.32 9.4% 233 FP1308R1-R32-R 320 230 52 40 233 FP1308R1-R44-R 440 317 37 28 233 R2 Version FP1308R2-R11-R 110 79 120 105 233 FP1308R2-R21-R 210 152 80 68 233 FP1308R2-R26-R 260 187 45 64 52 0.53 10% 233 FP1308R2-R32-R 320 230 52 40 233 FP1308R2-R44-R 440 317 37 28 233 R3 Version FP1308R3-R11-R 110 79 120 105 233 FP1308R3-R21-R 210 152 80 68 233 FP1308R3-R26-R 260 187 68 64 52 0.18 20% 233 FP1308R3-R32-R 320 230 52 40 233 FP1308R3-R44-R 440 317 37 28 233 1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 1.0V , 0.0Adc 5 I 2: Peak current for approximately 20% rolloff at +125C. rms sat -3 2 Full Load Inductance (FLL) Test Parameters: 100kHz, 1.0V , I 1. 6 K-factor: Used to determine B for core loss (see graph). B = K L I 10 . B (Gauss), rms sat * * * p-p p-p p-p K: (K-factor from table), L: (inductance in nH), I (peak-to-peak ripple current in amps). 3 I : DC current for an approximate temperature rise of 40C without core loss. Derating is rms 7 Part Number Definition: FP1308Rx-Rxx-R necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of other heat FP1308 = Product code and size generating components will affect the temperature rise. It is recommended the part temperature not exceed Rx = DCR indicator 125C under worst case operating conditions verified in the end application. Rxx = Inductance value in H, R = decimal point. 4 I : Peak current for approximately 20% rolloff at +25C. -R suffix = RoHS compliant sat Dimensions- mm Side View Top View Bottom View Recom m ended Pad Layout Schem atic 5.08 8.0 0.15 12.7 m ax 7.62 m ax b 1 1 1 3.18 2.54 0.3 7.2 7.5 13.4 2 typ. 1308Rx m ax Rxx wwllyy R 2 2 a The nominal DCR is measured from point a to point b All soldering surfaces to be coplanar within 0.1016mm. Part Marking: FP1308R (Rx = DRC indicator) Rxx = Inductance value in H. (R = Decimal point). wwllyy = Date code R = Revision level Packaging information - mm 4.0 1.5 dia 2.0 1.5 dia min A 1.75 Section A-A 1 11.5 24.0 0.3 13.9 1308Rx Rxx wwllyy R 2 13.2 A 8.2 User direction of feed 20.0 Supplied in tape-and-reel packaging, 400 parts per reel, 13 diameter reel. www.eaton.com/electronics 2