Effective June 2018 Technical Data 10673 Supersedes May 2017 FP2207R High frequency, high current power inductors Applications Multi-phase and Vcore regulators Voltage Regulator Modules (VRMs) and high- power density VRMs Server and desktop Central processing unit (CPU) Graphics processing unit (GPU) Application specific integrated circuit (ASIC) Data networking and storage systems Graphics cards and battery power systems Point-of-Load modules (POL) Product features Environmental data Storage temperature range (Component): High current carrying capacity -55 C to +125 C Low core loss Operating temperature range: -55 C to +125 C Magnetically shielded (ambient plus self-temperature rise) 22.5 mm x 8.2 mm footprint surface mount- Solder reflow temperature: package in a 7.25 mm height J-STD-020 (latest revision) compliant Moisture Sensitivity Level: 1 Halogen free, lead free, RoHS compliant Ferrite core material HALOGEN HF Pb FREEFP2207R Technical Data 10673 Effective June 2018 High frequency, high current power inductors Product Specifications 1 2 3 4 5 6 OCL FLL (nH) I I 1 I 2 I 3 DCR (m) rms sat sat sat 8 7 Part Number (nH) 10% minimum (A) (A) (A) (A) 15% +20 C K-factor R1 Version FP2207R1-R230-R 230 196 50 70 77 72 0.47 182.5 1. Open Circuit Inductance (OCL) Test Parameters: 1.0 MHz, 0.1 Vrms, 0.0 Adc, +25 C 7. K-factor: Used to determine B for core loss (see graph). p-p -3 2. Full Load Inductance (FLL) Test Parameters: 1.0 MHz, 0.1 Vrms, I 1, +25 C Bp-p = K * L * I * 10 B : (Gauss), K: (K-factor from table), p-p sat 3. I : DC current for an approximate temperature rise of 40 C without core loss. Derating is L: (Inductance in nH), I (Peak to peak ripple current in Amps). rms necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat 8. Part Number Definition: FP2207Rx-Rxxx-R generating components will affect the temperature rise. It is recommended that the temperature of the FP2207R= Product code and size part not exceed +125 C under worst case operating conditions verified in the end application. x= Version indicator 4. I 1: Peak current for approximately 5% rolloff +25 C Rxxx= Inductance value in H, R= decimal point sat 5. I 2: Peak current for approximately 20% rolloff +100 C -R suffix = RoHS compliant sat 6. I 3: Peak current for approximately 20% rolloff +125 C Note: Hipot: 250 Vdc minimum for 2 seconds, 0.1 mA sat conductor to uncoated core (test points c to d) Dimensions (mm) c typ d typ Part marking: FP2207Rx (x = Version indicator), Rxxx = Inductance value in uH, R= decimal point), xxxx=Lot code Tolerances are 0.15 unless stated otherwise Pad layout tolerances are 0.1 unless stated otherwise Soldering surfaces to be coplanar within 0.1 millimeters DCR measured from point a to point b Hipot measured from point c to point d Secure Inductor to PCB using Circuit Bond LV (or equivalent) adhesive for mechanical stability to meet Vibration, Mechanical shock and shear force requirements. Do not route traces or vias underneath the inductor 2 www.eaton.com/electronics