Effective September 2020 Technical Data 4430 Supersedes June 2015 HCM0503 High current power inductors Applications Voltage Regulator Module (VRM) Multi-phase regulators Point-of-Load modules Desktop and server VRMs and EVRDs Base station equipment Notebook and laptop regulators Battery power systems Graphics cards Data networking and storage systems Environmental compliance and general specifications Product features Storage temperature range (Component): High current carrying capacity -55 C to +125 C Low core losses Operating temperature range: -55 C to +125 C (ambient + self-temperature rise) Magnetically shielded, low EMI Solder reflow temperature: Frequency range up to 1 MHz J-STD-020 (latest revision) compliant Inductance range from 0.2 H to 22 H HALOGEN Current range from 1.9 A to 22 A Pb HF 5.5 mm x 5.3 mm footprint surface mount FREE package in a 3.0 mm height Iron powder core material HCM0503 Technical Data 4430 Effective September 2020 High current power inductors Product Specifications DCR (m) 1 2 3 4 OCL FLL (H) I I typical DCR (m) rms sat 6 5 Part Number (H) 20% minimum (A) (A) +20 C maximum +20 C K-factor HCM0503-R20-R 0.20 0.13 22.2 21.0 2.1 2.31 1764 HCM0503-R35-R 0.35 0.22 16.6 14.9 3.9 4.29 1259 HCM0503-R47-R 0.47 0.30 12.0 11.5 6.5 7.15 820 HCM0503-R75-R 0.75 0.48 11.3 9.7 8.5 9.35 801 HCM0503-1R0-R 1.0 0.64 10.1 8.5 10.4 11.44 588 HCM0503-1R5-R 1.5 0.96 7.5 7.0 17.1 18.5 393 HCM0503-2R2-R 2.2 1.4 6.8 6.5 22.5 25 325 HCM0503- 3R3-R 3.3 2.1 5.5 6.0 36.4 40.4 273 HCM0503-4R7-R 4.7 3.0 4.5 5.5 54 60.0 226 HCM0503-5R6-R 5.6 3.6 4.3 3.5 63 70.6 206 HCM0503-100-R 10 6.4 2.8 2.3 122.1 131.9 158 HCM0503-150-R 15 9.6 2.4 2.1 138.4 166.2 127 HCM0503-220-R 22 14 1.9 1.9 260 270 106 1. Open circuit inductance (OCL) test parameters: 100 kHz, 0.25 Vrms, 0.0 Adc, +25 C 4. I : Peak current for approximately 20% rolloff +25 C sat 2. Full load inductance (FLL) test parameters: 100 kHz, 0.25 Vrms, I , +25 C 5. K-factor: Used to determine B for core loss (see graph). Bp-p = K * L * I. B : (Gauss), K: (K-factor from table), L: p-p p-p sat 3. I : DC current for an approximate temperature rise of 40 C without core loss. Derating is necessary for AC currents. (Inductance in H), I (Peak to peak ripple current in Amps). rms PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the 6. Part Number Definition: HCM0503-xxx-R temperature rise. It is recommended that the temperature of the part not exceed +125 C under worst case operating HCM0503 = Product code and size conditions verified in the end application. xxx= inductance value in H, R= decimal point , If no R is present then last character equals number of zeros -R suffix = RoHS compliant Dimensions (mm) Recommended Pad Layout Schematic 1.0 3.15 3.0 2.2 5.15 0.3 max typ. 0.35 1 1 2.05 XXX 5.10 2.2 1 2 wly 2 1 0.2 R 2 1.5 2 0.30 a b Part marking: xxx=inductance value in uH, R= decimal point. If no R is present then last character equals number of zeros. wly=date code, R=revision level All soldering surfaces to be coplanar within 0.1 millimeters Tolerances are 0.2 millimeters unless stated otherwise DCR measured from point a to point b Color: Grey Traces or vias underneath the inductor is not recommended 2 www.eaton.com/electronics