Effective July 2018 Technical Data 10649 MPI25-V2 High current, low profile, miniature power inductors Applications Mobile/smart phones Handheld/mobile equipment Tablets/e-readers Digital cameras Wearable devices Notebook/netbook/laptop regulators Portable media players Environmental data Storage temperature range (Component): Product features -40 C to +125 C High current carrying capacity in a compact Operating temperature range: -40 C to +125 C standard 1008 (2520 metric) footprint (ambient plus self-temperature rise) Magnetically shielded, Low EMI Solder reflow temperature: Rugged construction J-STD-020 (latest revision) compliant Self resonant frequency (SRF) greater Halogen free, lead free, RoHS compliant than 25 MHz HALOGEN Inductance range from 0.33 H to 4.7 H HF Pb Current range from 1.2 A to 7.5 A FREE 2.7 mm x 2.2 mm footprint surface mount pack- age in 1.05 mm, 1.25 mm heights Moisture Sensitivity Level (MSL): 1MPI25-V2 Technical Data 10649 Effective July 2018 High current, low profile, miniature power inductors Product specifications SRF 1 2 3 OCL I I DCR (m) DCR (m) rms sat (MHz) 5 4 Part Number (H) 20% (A) (A) typical +20 C maximum +20 C typical K-factor 1.0 mm height MPI2510V2-R33-R 0.33 4.8 15 20 120 6336 6.6 MPI2510V2-R47-R 0.47 4.4 19 25 100 5039 6.0 MPI2510V2-R68-R 0.68 3.1 37 44 80 5733 4.3 MPI2510V2-1R0-R 1.00 3.1 41 52 55 3372 4.3 MPI2510V2-1R5-R 1.50 2.5 65 85 45 4695 2.5 MPI2510V2-2R2-R 2.20 2.1 88 110 45 2873 2.8 MPI2510V2-3R3-R 3.30 1.6 140 170 35 1893 2.1 MPI2510V2-4R7-R 4.70 1.22 220 262 25 1616 1.8 1.2 mm height MPI2512V2-R33-R 0.33 5.1 14 19 130 6560 7.5 MPI2512V2-R47-R 0.47 4.9 17 23 100 3628 6.7 MPI2512V2-R68-R 0.68 3.4 29 35 70 3633 6.0 MPI2512V2-1R0-R 1.00 3.3 36 44 70 3083 4.4 MPI2512V2-1R5-R 1.50 2.3 64 77 45 4850 3.2 MPI2512V2-2R2-R 2.20 2.2 73 87 30 2924 3.5 MPI2512V2-3R3-R 3.30 1.8 110 135 35 1965 2.8 MPI2512V2-4R7-R 4.70 1.4 196 235 25 1580 1.9 1. Open Circuit Inductance (OCL) Test Parameters: 1.0 MHz, 0.1 Vrms, 0.0 Adc, +25 C. 4. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * I. Bp-p :(Gauss), 2. I : DC current for an approximate temperature rise of 40 C without core loss. Derating is K: (K-factor from table), L: (Inductance in uH), I (Peak to peak ripple current in Amps). rms necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of 5. Part Number Definition: MPI25xxV2-xxx-R other heat generating components will affect the temperature rise. It is recommended that the MPI25 = Product code temperature of the part not exceed +125 C under worst case operating conditions verified in the xx= Height indicator end application. V2=Version indicator 3. I : Peak current for approximately 30% rolloff +25 C. xxx= inductance value in H, R= decimal point, If no R is present then last character equals sat number of zeros -R suffix = RoHS compliant Dimensions (mm) Dimension A MPI2510V2 1.05 maximum MPI2512V2 1.25 maximum, No marking All soldering surfaces to be coplanar within 0.10 millimeters Tolerances are 0.2 millimeters unless stated otherwise Pad layout tolerances are 0.1 millimeters unless stated otherwise Do not route traces or vias underneath the inductor 2 www.eaton.com/electronics