Yi 5W Series Yi Yi is the English translation for the Chinese word meaning Dazzling or Sparkling. This multi-chip package has the brightness to illuminate the space around it, a beacon in the dark. Introduction The Yi series is a high power, 4-chip device with very low thermal resistance as a result of the ceramic substrate. The series is a surface-mount high-power device featuring high brightness combined with a compact size that is suitable for all kinds of lighting applications such as general illumination, spot, signal, industrial and commercial lighting. Features Applications General Lighting Soldering method: SMT Indoor and Outdoor Lighting Binning Parameters: Brightness, Forward Retrofit Bulbs Voltage, Wavelength and Chromaticity Decorative and Entertainment Moisture Sensitivity Level:1 Lighting RoHS compliant Signal Lighting/Beacon Lighting Matches ANSI binning Exterior and Interior Automotive Reliability testing conforms to IESNA LM80 Illumination Lumen maintenance test method Copyright 2011, Everlight All Rights Reserved. Release Date: 04.09.2012. Issue No: DHE-0001157 1 www.everlight.com DATASHEET YI 5W Series Table of Contents Product Nomenclature .................................................................................................................................... 3 Absolute Maximum Ratings ........................................................................................................................... 4 JEDEC Moisture Sensitivity........................................................................................................................... 4 Luminous Flux Characteristics for the Yi series ............................................................................................. 5 PN of Yi High Luminous Series: White LEDs ............................................................................................. 11 White Bin Structure ...................................................................................................................................... 17 Forward Voltage Bins ................................................................................................................................... 23 Optical Characteristics.................................................................................................................................. 24 Mechanical Dimension ................................................................................................................................. 25 Pad Configuration ......................................................................................................................................... 26 Reflow Soldering Characteristics ................................................................................................................. 27 Wavelength Characteristics .......................................................................................................................... 28 Typical Light Output Characteristic vs. Thermal Pad Temperature ............................................................. 29 Typical Electrical Characteristics ................................................................................................................. 30 Typical Relative Luminous Flux vs. Forward Current ................................................................................. 30 Typical CCT Shift Characteristics vs. Forward Current ............................................................................... 31 Current Derating Curves............................................................................................................................... 32 Typical Radiation Patterns ............................................................................................................................ 33 Typical Radiation Patterns ............................................................................................................................ 35 Emitter Tape Packaging ................................................................................................................................ 37 Emitter Reel Packaging ................................................................................................................................ 38 Product Labeling .......................................................................................................................................... 38 Storage Conditions ....................................................................................................................................... 39 Revision History ........................................................................................................................................... 40 Copyright 2011, Everlight All Rights Reserved. Release Date: 04.09.2012. Issue No: DHE-0001157 2 www.everlight.com