X-On Electronics has gained recognition as a prominent supplier of H330S Q50-00-MINI_PCIE-00 RF Modules across the USA, India, Europe, Australia, and various other global locations. H330S Q50-00-MINI_PCIE-00 RF Modules are a product manufactured by Fibocom. We provide cost-effective solutions for RF Modules, ensuring timely deliveries around the world.

H330S Q50-00-MINI_PCIE-00 Fibocom

H330S Q50-00-MINI_PCIE-00 electronic component of Fibocom
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See Product Specifications
Part No.H330S Q50-00-MINI_PCIE-00
Manufacturer: Fibocom
Category: RF Modules
Description: Module: GSM; HSPA+, WCDMA; 3G; GPIO, SIM, UART x2,USB; 3.3÷4.2VDC
Datasheet: H330S Q50-00-MINI_PCIE-00 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 60.2518 ea
Line Total: USD 60.25

Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Wed. 17 Jul to Tue. 23 Jul
MOQ : 1
Multiples : 1
1 : USD 60.2518

   
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We are delighted to provide the H330S Q50-00-MINI_PCIE-00 from our RF Modules category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the H330S Q50-00-MINI_PCIE-00 and other electronic components in the RF Modules category and beyond.

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M2M The H330S Q50-00-MINI_PCIE-00 is a cellular module from Fibocom. It is a CAT 4 LTE module that supports global multimode networks. This module is based on the Qualcomm Snapdragon X7 LTE modem and provides download speeds up to 150 Mbps and upload speeds up to 50 Mbps. The module provides a maximum power output of 19 dBm and it is compatible with multiple operating systems including Windows, Linux, and Android. This module is certified for application in the North America, Europe, and Asia regions. It also comes with built-in global navigation satellite system (GNSS) for location tracking and monitoring. The module supports various communication protocols such as TCP, UDP, PPP, HTTP and can be used for a variety of applications ranging from asset tracking to remote device management.

Tariff Desc

8542.3 - Electronic integrated circuits:
8542.31.00 -- Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
.Digital:
61 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products
62 No ..Other
63 No Hybrid integrated circuits
64 No Multichip integrated circuits

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