Data sheet Product EMB 135 150 SA Cases>Heat dissipating case Embedded case contents of delivery: 1 = 1 x case prole 2 = 2 x cover panel 3 = 1 x bottom panel 4 = mounting material universal cooling n case made of aluminium extruded prole, cover panels in 2 mm thickness and removable bottom panel optimized heat dissipation by means of external cooling ns the integrated T-grooves in the case prole for mounting of i.e. mainboards in the Mini-ITX or NUC form factor by means of distance, bolts and mounting plate also EBX, Nano ITX, EPIC, ETX/XTX and PC/104 form factors by means internal guide grooves for inserting PCBs or mounting plates wall-, ceiling- or top-hat rail mounting by means of xingstraps or top-hat rail mounting from the bottom special designs, embedded cover panels, machinings, surfaces and printings upon request * accessories mounting set BFS Features surface: black anodised way of xation (optional): xing of mounting rail mountingstrap set Technical Drawing length: 150mmFurther Information