X-On Electronics has gained recognition as a prominent supplier of ICK BGA 11 X 11 X 6 Heat Sinks across the USA, India, Europe, Australia, and various other global locations. ICK BGA 11 X 11 X 6 Heat Sinks are a product manufactured by Fisher. We provide cost-effective solutions for Heat Sinks, ensuring timely deliveries around the world.

ICK BGA 11 X 11 X 6 Fisher

ICK BGA 11 X 11 X 6 electronic component of Fisher
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Part No.ICK BGA 11 X 11 X 6
Manufacturer: Fisher
Category: Heat Sinks
Description: Heatsink: extruded; black; L:11mm; W:11mm; H:6mm; aluminium
Datasheet: ICK BGA 11 X 11 X 6 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 4.0425 ea
Line Total: USD 4.04 
Availability - 13
Ship by Wed. 27 Nov to Fri. 29 Nov
MOQ: 1  Multiples: 1
Pack Size: 1

 ICK BGA 11 X 11 X 6 More Buying Options & Price Grid(s)

Availability Price Quantity
13
Ship by Wed. 27 Nov to Fri. 29 Nov
MOQ : 1
Multiples : 1
1 : USD 4.0425
7 : USD 2.9106
17 : USD 2.7636

Specifications

   
Manufacturer
Product Category
Length
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Type Of Heatsink
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the ICK BGA 11 X 11 X 6 from our Heat Sinks category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the ICK BGA 11 X 11 X 6 and other electronic components in the Heat Sinks category and beyond.

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Additional Infomation About Product

The ICK BGA 11 X 11 X 6 part is a Grid Array Integrated Circuit package from Fisher. This package measures 11 millimeters wide by 11 millimeters long and is 6 mm thick. It is designed to contain up to 172 pins. It features a very small profile and leads that are separated from the board. It is designed to allow for very high-density placement of the pins, enabling greater functionality and density. It is suitable for applications needing low-power and high-speed communication, digital signal processing and power management. The ICK BGA 11 X 11 X 6 package is an ideal choice for gamers, medical devices, telecommunications, and other products needing compact form factors and reliable performance.

HS Compliance

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:

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