X-On Electronics has gained recognition as a prominent supplier of ICK BGA 15 X 15 X 14 Heat Sinks across the USA, India, Europe, Australia, and various other global locations. ICK BGA 15 X 15 X 14 Heat Sinks are a product manufactured by Fisher. We provide cost-effective solutions for Heat Sinks, ensuring timely deliveries around the world.

ICK BGA 15 X 15 X 14 Fisher

ICK BGA 15 X 15 X 14 electronic component of Fisher
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See Product Specifications
Part No.ICK BGA 15 X 15 X 14
Manufacturer: Fisher
Category: Heat Sinks
Description: Heatsink: extruded; grilled; black; L: 15mm; W: 15mm; H: 14mm
Datasheet: ICK BGA 15 X 15 X 14 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 4.7187 ea
Line Total: USD 4.72 
Availability - 345
Ship by Tue. 24 Dec to Thu. 26 Dec
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
345
Ship by Tue. 24 Dec to Thu. 26 Dec
MOQ : 1
Multiples : 1
1 : USD 4.7187
5 : USD 3.6456
14 : USD 3.4398

   
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We are delighted to provide the ICK BGA 15 X 15 X 14 from our Heat Sinks category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the ICK BGA 15 X 15 X 14 and other electronic components in the Heat Sinks category and beyond.

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The ICK BGA 15 X 15 X 14 with Heatsink is a state-of-the-art integrated circuit package designed for use in high-performance electronic applications. The package is a BGA (Ball Grid Array) type, with a size of 15 X 15 X 14 millimeters (L x W x H) and includes an extruded black aluminum heatsink with a grill pattern for optimal heat dissipation. This part is manufactured by Fisher, a leading company in the field of IC packages and associated components. It is ideally suited for applications requiring efficient, compact, and reliable thermal management.

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:
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