&Bloom The ICK BGA 29 X 29 X 14 with Heatsink is a semiconductor device manufactured by Fisher&Bloom. It has a black-colored, extruded aluminum housing with a grille on the top for cooling, with dimensions of length 29mm, width 29mm, and height 14mm. It has been designed to dissipate heat away from an integrated circuit in order to protect the electronic components from over-heating. The heatsink is made of aluminum, and features efficient thermal conductivity. It also includes a metal cage frame, which secures the integrated circuit in place. The ICK BGA 29 X 29 X 14 with Heatsink is suitable for use in a wide range of applications such as computer motherboards, telecommunications systems, embedded systems, and more.