X-On Electronics has gained recognition as a prominent supplier of ICK BGA 35X35 Heat Sinks across the USA, India, Europe, Australia, and various other global locations. ICK BGA 35X35 Heat Sinks are a product manufactured by Fisher. We provide cost-effective solutions for Heat Sinks, ensuring timely deliveries around the world.

ICK BGA 35X35 Fisher

ICK BGA 35X35 electronic component of Fisher
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Part No.ICK BGA 35X35
Manufacturer: Fisher
Category: Heat Sinks
Description: HEAT SINK, BALL GRID
& Paykel 35x35 mm footprint, ball grid array package, used in Fisher & Paykel Appliances
Datasheet: ICK BGA 35X35 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 2.1609 ea
Line Total: USD 2.16 
Availability - 153
Ship by Tue. 24 Dec to Thu. 26 Dec
MOQ: 1  Multiples: 1
Pack Size: 1

 ICK BGA 35X35 More Buying Options & Price Grid(s)

Availability Price Quantity
153
Ship by Tue. 24 Dec to Thu. 26 Dec
MOQ : 1
Multiples : 1
1 : USD 2.1609
10 : USD 1.9551
12 : USD 1.5876
32 : USD 1.4994

Specifications

   
Manufacturer
Product Category
Thermal Resistance
Packages Cooled
External Height - Metric
External Width - Metric
External Length - Metric
External Diameter - Metric
Heat Sink Material
External Height - Imperial
External Width - Imperial
External Length - Imperial
External Diameter - Imperial
Svhc
Mounting Type
Surface Finish
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the ICK BGA 35X35 from our Heat Sinks category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the ICK BGA 35X35 and other electronic components in the Heat Sinks category and beyond.

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Additional Infomation About Product

brand The ICK BGA 35X35 is a type of integrated circuit packaging solution that is produced by Fisher. It features solderable Ball Grid Array (BGA) technology with a 35x35 array configuration and up to 600 I/O pins. This type of packaging is designed for high-performance computing applications where space and signal integrity are of utmost importance. It also offers improved signal and power distribution, as well as better thermal dissipation compared to comparable through-hole components. It is typically used in devices such as server and embedded processor boards, large graphics cards, and small footprint applications. The ICK BGA 35X35 is an ideal choice for many advanced computer applications.

HS Compliance

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:

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