Ericsson Internal Limited Internal EE PRODUCT STABLE OF CONTEPECIFICATION NTS 1 (1)1 (3) PrPreparepareedd ( (aallsso so subjubjecectt r reesponsisponsibbllee i iff othotheerr)) NNoo MPM/BY/P HMPM/BY/P Henrienrikk Sund Sundh h 1/1301 BM00152-EN/LZR 642 8/M UeT146330 n Technical SpecicationTechnical Speci cation ApprApprovoved Ced Checked hecked DDate ate RReevv RRefereferencence e EN/LZT 146 330EN/LZT 146 330 R1A R1B MarchFebruary 2013 2006 PPME 8000ME 8000F series) series MPM/BY/M Krister Lundberg 20062006-02-02--28 28 A A Ericsson AB Ericsson Power Modules AB POLPOL regulator, Input 10.8-13.2 V, Output 6 A/10.8 W regulator, Input 10.8-13.2 V, Output 6 A/10.8 W Key Features 6A output current (8A peak current) 11.8 -13.2V input voltage range DDR/QDR compatible output voltage V tracks V in range of 0.55V to 1.8V TT REF Industry standard POLA compatible 22.1 x 12.57 x 8.51 mm (0.87 x 0.5 x 0.335 in.) More than 4.5 million hours MTBF General Characteristics Operating temperature: -40C to 85C Input under voltage protection Start up into a pre-biased output safe Output short-circuit protection On/Off inhibit control (V standby) TT Highly automated manufacturing ensures quality ISO 9001/14001 certified supplier Safety Approvals Design for Environment Meets requirements in high- temperature lead-free soldering processes. Contents General Information .............................................................2 Safety Specification .............................................................3 Absolute Maximum Ratings .............................................................4 Product Program Ordering No. 0.55-1.8 V/6 A PME 8118VxF ........................................ 1.25 V/6 A Electrical Specification .............................................................5 EMC Specification .............................................................8 Operating Information .............................................................8 Thermal Consideration ...........................................................10 Connections ...........................................................10 Mechanical Information ...........................................................11 Soldering Information ...........................................................13 Delivery Information ...........................................................15 Product Qualification Specification ...........................................................16 Ericsson Internal EE PRODUCT SPECIFICATION 2 (3) Prepared (also subject responsible if other) No. MPM/BY/P Henrik Sundh 1/1301 BMR 642 8/M Uen 2 2 Technical SpecicationTechnical Speci cation Approved Checked Date Rev Reference EN/LZT 146 330EN/LZT 146 330 R1A R1B MarchFebruary 2013 2006 PPME 8000ME 8000F series) series MPM/BY/M Krister Lundberg 2006-02-28 A Ericsson AB Ericsson Power Modules AB POLPOL regulator, Input 10.8-13.2 V, Output 6 A/10.8 W regulator, Input 10.8-13.2 V, Output 6 A/10.8 W - Lead in solder for servers, storage and storage array General Information systems, network infrastructure equipment for switching, signalling, transmission as well as network Ordering Information management for telecommunication See Contents for individual product ordering numbers. (Note: the products are manufactured in lead-free soldering processes and the lead present is only Option Suffix located in the terminal plating finishes on some Through hole pin P PME8118VPF components) SMD pin S PME8118VSF SMD pin, leadfree reflow Quality Statement temperature capable R PME8118VSRF The products are designed and manufactured in an industrial environment where quality systems and methods Reliability like ISO 9000, 6 (sigma), and SPC are intensively in use to The Mean Time Between Failure (MTBF) is calculated at full boost the continuous improvements strategy. Infant output power and an operating ambient temperature (T ) of A mortality or early failures in the products are screened out +40C. Different methods could be used to calculate the and they are subjected to an ATE-based final test. predicted MTBF and failure rate which may give different Conservative design rules, design reviews and product results. Ericsson Power Modules currently uses Telcordia qualifications, plus the high competence of an engaged SR332. work force, contribute to the high quality of our products. Predicted MTBF for the series is: Warranty - 4.40 million hours according to Telcordia SR332, issue Warranty period and conditions are defined in Ericsson 1, Black box technique. Power Modules General Terms and Conditions of Sale. Telcordia SR332 is a commonly used standard method Limitation of Liability intended for reliability calculations in IT&T equipment. The Ericsson power Modules does not make any other parts count procedure used in this method was originally warranties, expressed or implied including any warranty of modelled on the methods from merchantability or fitness for a particular purpose MIL-HDBK-217F, Reliability Predictions of Electronic (including, but not limited to, use in life support Equipment. applications, where malfunctions of product can cause It assumes that no reliability data is available on the actual injury to a persons health or life). units and devices for which the predictions are to be made, i.e. all predictions are based on generic reliability parameters. Compatibility with RoHS requirements The products are compatible with the relevant clauses and requirements of the RoHS directive 2002/95/EC and have a maximum concentration value of 0.1% by weight in homogeneous materials for lead in other applications other than lead in solder, lead in high melting temperature type solder, lead in glass of electronics components, lead in electronic ceramic parts and lead as an alloying element in copper containing up to 4% lead by weight, mercury, hexavalent chromium, PBB and PBDE and of 0.01% by weight in homogeneous materials for cadmium. Exemptions in the RoHS directive utilized in the products: - Lead as an alloying element in copper alloy containing up to 4% lead by weight (used in connection pins made of Brass) - Lead in high melting temperature type solder (used to solder the die in semiconductor packages) - Lead in glass of electronics components and in electronic ceramic parts (e.g. fill material in chip resistors)