GBU10G GeneSiC Semiconductor

GBU10A thru GBU10G V = 50 V - 400 V RRM Single Phase Glass Passivated I = 10 A O Silicon Bridge Rectifier Features Epoxy Resin material compliant with 94V-0 standards of UL UL Material Flammability Provisions Compliant with UL Provisions, UL Code: E303851 GBU Package Ideal for printed circuit boards High surge overload rating High temperature soldering guaranteed: 260C/ 10 seconds, 9.5 mm lead length Not ESD Sensitive Mechanical Data Case: Epoxy resin body over passivated junctions Weight: 4.60 g Mounting position: Any Maximum ratings at T = 25 C, unless otherwise specified A Parameter Symbol Conditions GBU10A GBU10B GBU10D GBU10G Unit Repetitive peak reverse voltage V 50 100 200 400 V RRM V 140 280 RMS reverse voltage 35 70 V RMS V DC blocking voltage 50 100 200 400 V DC Operating temperature T -40 to 150 -40 to 150 -40 to 150 -40 to 150 C j Storage temperature T -40 to 150 -40 to 150 -40 to 150 -40 to 150 C stg Electrical characteristics at T = 25 C, unless otherwise specified A Single phase, half sine wave, 50 Hz, resistive load For capacitive load derate current by 20% Conditions GBU10D GBU10G Parameter Symbol GBU10A GBU10B Unit (1) (1) (1) (1) T = 100 C C 10 10 10 10 I Maximum forward rectified current A O (2) (2) (2) (2) T = 25 C A 3.5 3.5 3.5 3.5 t = 10 ms, T = 25 C Peak forward surge current I 225 225 225 225 A FSM p j V I = 5 A 1.05 1.05 V Maximum forward voltage drop 1.05 1.05 F F T = 25 C 5 5 5 5 Maximum reverse current at rated DC A I A R blocking voltage T = 125 C 500 500 500 500 A AC voltage: 1 min Insulation strength (lead wire to case) V 2.5 2.5 2.5 2.5 kV dis leakage current<1mA 2 2 Rating for fusing at T = 25 C 1ms < t < 10 ms 80 80 I t p 80 80 A s j (2) (2) (2) (2) R JA 23 23 23 23 Typical thermal resistance C/W (1) (1) (1) (1) R 5.0 5.0 5.0 5.0 JC Mounting Torque M 0.8 (0.5 N.m is recommended) N.m 1 - Device mounted on 65 mm x 35 mm x 1.5 mm heatsink 2 - Device mounted on PCB without heatsink 3 - Recommended mounted position is to bolt down device on a heatsink with silicon thermal compond for maximum heat transfer using M3 screw. 1 Oct. 2018 GBU10A thru GBU10G 2 Oct. 2018