GBU10J thru GBU10M V = 600 V - 1000 V RRM Single Phase Glass Passivated Silicon I = 10 A O Bridge Rectifier Features Epoxy Resin material compliant with 94V-0 standards of UL UL Material Flammability Provisions Compliant with UL Provisions, UL Code: E303851 GBU Package Ideal for printed circuit boards High surge overload rating High temperature soldering guaranteed: 260C/ 10 seconds, 9.5 mm lead length Not ESD Sensitive Mechanical Data Case: Epoxy resin body over passivated junctions Weight: 4.60 g Mounting position: Any Maximum ratings at T = 25 C, unless otherwise specified A Parameter Symbol Conditions GBU10J GBU10K GBU10M Unit Repetitive peak reverse voltage V 600 800 1000 V RRM V 700 RMS reverse voltage 420 560 V RMS V DC blocking voltage 600 800 1000 V DC Operating temperature T -40 to 150 -40 to 150 -40 to 150 C j Storage temperature T -40 to 150 -40 to 150 -40 to 150 C stg Electrical characteristics at T = 25 C, unless otherwise specified A Single phase, half sine wave, 50 Hz, resistive load For capacitive load derate current by 20% Conditions GBU10M Parameter Symbol GBU10J GBU10K Unit (1) (1) (1) T = 100 C C 10 10 10 I Maximum forward rectified current A O (2) (2) (2) T = 25 C A 3.5 3.5 3.5 t = 10 ms, T = 25 C Peak forward surge current I 225 225 225 A FSM p j V I = 5 A 1.05 V Maximum forward voltage drop F F 1.05 1.05 T = 25 C 5 5 5 Maximum reverse current at rated DC A I A R blocking voltage T = 125 C 500 500 500 A AC voltage: 1 min Insulation strength (lead wire to case) V 2.5 2.5 2.5 kV dis leakage current<1mA 2 2 Rating for fusing at T = 25 C 1ms < t < 10 ms 80 80 80 j I t p A s (2) (2) (2) R JA 23 23 23 Typical thermal resistance C/W (1) (1) (1) R 5.0 5.0 5.0 JC Mounting Torque M 0.8 (0.5 N.m is recommended) N.m 1 - Device mounted on 65 mm x 35 mm x 1.5 mm heatsink 2 - Device mounted on PCB without heatsink 3 - Recommended mounted position is to bolt down device on a heatsink with silicon thermal compond for maximum heat transfer using M3 screw. 1 Oct. 2018 GBU10J thru GBU10M 2 Oct. 2018