R-14-0077 GTT WIRELESS

PCB Mounting Pillars Features and Application: Enhance the grounding of the cinterion module to the PCB Simple production process 1. SMT process to solder mounting pillars to the PCB 2. Self-locking screw solution for mounting the module on to the mounting pillars Flexible solution with easy access to remove the module Mounting Pillar and Screw Specifications: Inner Raw Material : Ms58 (C3602) copper alloy First Plating Layer : Copper flash Second Plating Layer : Nickel plating (1 m) Third Plating Layer : Gold plating (0.8 m) Weight : 0.35 g Dimensions : Millimetres Stacking Height Definition When both connectors are mated together: Mounting Instructions Dimensions : Millimetres Plated PCB hole size to accommodate the solder mounting pillars : 2.9 0.02 mm PCB footprint for hole locations : Please refer to the cinterion module datasheet www.element14.com www.farnell.com www.newark.com Page <1> 13/06/12 V1.1PCB Mounting Pillars Step1 : SMT Process For Mounting Pillars Step2 : Mounting the Module with Self-Locking Screws Dimensions : Millimetres The torque values for tightening the screws are: Recommended torque for tightening : 1.5 kgf.cm Maximum torque for tightening : 1.7 to 1.8 kgf.cm Part Number Table Description Part Number Pillar for Cinterion Module, 3 mm R-14-0076 Pillar for Cinterion Module, 5 mm R-14-0077 Important Notice : This data sheet and its contents (theInformatio) belong to the members of the Premier Farnell group of companies (theGrou) or are licensed to it. No licence is granted for the use of it other than for information purposes in connection with the products to which it relates. No licence of any intellectual property rights is granted. The Information is subject to change without notice and replaces all data sheets previously supplied. The Information supplied is believed to be accurate but the Group assumes no responsibility for its accuracy or completeness, any error in or omission from it or for any use made of it. Users of this data sheet should check for themselves the Information and the suitability of the products for their purpose and not make any assumptions based on information included or omitted. Liability for loss or damage resulting from any reliance on the Information or use of it (including liability resulting from negligence or where the Group was aware of the possibility of such loss or damage arising) is excluded. This will not operate to limit or restrict the Group s liability for death or personal injury resulting from its negligence. Multicomp is the registered trademark of the Group. Premier Farnell plc 2012. www.element14.com www.farnell.com www.newark.com Page <2> 12/06/12 V1.1