TechnicalDataSheet LOCTITE GC 10 March-2019 PRODUCT DESCRIPTION Particle Size Distribution (PSD) (J-STD- 005A ) LOCTITE GC 10 provides the followingproduct characteristics: Type 3 Powder Powder Description T3 Technology No-clean and Halogen-free Solder Paste Powder Particle Size Distribution 25 to 45 m Application Pb-free soldering Henkel Former Description AGS LOCTITE GC 10 is a halogenfree,zero halogens added, no-clean,low Type 4 Powder voiding, Pb-free solder paste specially formulated to provide added Powder Description T4 long term stabilityover a wide range of temperature conditions. The Powder Particle Size Distribution 20 to 38 m enhanced paste stability createdthrough itsnovel formulation strategy Henkel Former Description DAP increases both fieldapplicationyields and on-linepaste utilization. Type 5 Powder LOCTITE GC 10 also shows excellentsolderability when reflowed in Powder Description T5 both air and nitrogenacross a wide range of challengingsurface Powder Particle Size Distribution 15 to 25 m finishes and component metallizationsincluding immersion Ag, Henkel Former Description KBP OSP-Cu, ENIG and CuNiZn .Itsupports excellentreflow to overcome industry wide HiP and NWO challenges. The new flux chemistry protects the solder jointlonger,improves coalescence and optimizes wettingperformance, allowingfor very shiny solder joints. Solder Alloy ( J-STD 006) LOCTITE Code SAC305 LOCTITE GC 10 is suitable for use with industry standard SAC alloys . Henkel Former Description 97SC FEATURES AND BENEFITS Alloy Composition Sn96.5 Ag3.0Cu0.5 Halogen-free flux: passes ICwith pretreatmentIPC-TM-650 Melting Point (C) 217 EN14582 Ag % 3.0 Halogen-free flux classification: ROL0 to ANSI/J-STD-004 Rev. B Solder Paste Typical Properties Printing:down to 0.3mm pitch Based on T3 powder Printing:up to 72hours stencillife MetalContent,% 88.5 Printing:up to 24 hours abandon time Brookfield Viscosity 25 C ,mPas (cP) 933,000 -1 Printing:suitable for high-speed printingup to 125 mms Spindle TF,speed 5 rpm ,after2 minutes Printing:improved paste-transfer efficiency Malcom Viscosity 25 C ,Pa.s 207 Reflow: enhanced soak process window 150-200C Speed 10 rpm (temperature and time) Malcom Thixotropic Index 0.52 Reflow: enhanced process window with superior coalescence IPC Slump A21 ,mm and wetting 25 C, 15 minutes Reflow: minimalhot slump at182C 0.33x 2.03 mm pads 0.10 Reflow: superior coalescence and wettingon small 0.63x 2.03 mm pads 0.33 components including 01005 IPC Slump A21 ,mm Reflow: very shiny solder joints 182 C, 15 minutes Reflow: clear,colorless residues for easy post-reflow inspection 0.33x 2.03 mm pads 0.15 0.63x 2.03 mm pads 0.33 Reflow: residues printtestableafter4x reflows Based on T4 powder TYPICAL PROPERTIES MetalContent,% 88.5 Solder Powder Brookfield Viscosity 25 C ,mPas (cP) 900,000 Solder powder is produced to a quality level thatexceeds IPC industry Spindle TF,speed 5 rpm ,after2 minutes requirements for sphericity, size distribution, impurities and oxide Malcom Viscosity 25 C ,Pa.s 190 levels. Speed 10 rpm Malcom Thixotropic Index 0.5 Allsolder powders are RoHS compliant. IPC Slump A21 ,mm 25 C, 15 minutes 0.33x 2.03 mm pads 0.10 0.63x 2.03 mm pads 0.33TDS LOCTITE GC 10, March-2019 IPC Slump A21 ,mm RELIABILITYPROPERTIES 182 C, 15 minutes Solder Paste Medium: 0.33x 2.03 mm pads 0.20 LOCTITE GC 10 medium contains a stable resin system , slow 0.63x 2.03 mm pads 0.33 evaporating solvents and with minimalodor .The formulation has been tested to therequirements of the ANSI/J-STD-004B for a type ROL0 Based on T5 powder classification specification. MetalContent,% 88.5 Test Specification Results Brookfield Viscosity 25C, mPa.s 883,000 Spindle TF,Speed 5 rpm, 2 minutes Flux Corrosion J-STD004B (2.6.15C) Pass Malcom Viscosity 25C, Pa.s 209 Copper Mirror J-STD004B (2.3.32D) Pass Speed 10 rpm Surface Insulation J-STD004B (2.6.3.7) Pass Malcom Thixotropic Index 0.48 Resistance (SIR) IPC Slump A20 ,mm Electromigration(ECM) J-STD004B (2.6.14.1) Pass 25 C, 15 minutes Flux Activity Classification J-STD004B ROL0 0.20x 2.03 mm pads 0.075 0.33x 2.03 mm pads 0.06 STORAGE AND SHELF LIFE IPC Slump A20 ,mm Storage: 182 C, 15 minutes Optimal storage: 5 to 25 C ( 1.5C) 0.20x 2.03 mm pads 0.125 Storage information may be indicated on the product container 0.33x 2.03 mm pads 0.15 labelling.Materialremoved from containers may be contaminated during use. Do not return products to theoriginalcontainer.Henkel Corporation cannot assume responsibility for product that has been contaminatedor stored under conditions other thanthose previously DIRECTIONS FOR USE indicated. Ifadditionalinformationis required, please contactyour Printing: localTechnicalService Center or Customer Service Representative. LOCTITE GC 10 is availablefor stencilprintingwith Type 3,Type 4 and Type 5 powder . Shelf Life: -1 Printingat speeds between 25 to 125 mms can be achieved Provided thatLOCTITE GC 10 is stored intheoriginalcontainer,a using laser cut , electropolished or electroformed stencils with minimum shelflifeof 365 days at 5 to 25 C ( 1.5C) or 31 days at metalsqueegees . 40C can be expected. Reflow: Ifstored below 20C, allow to stabilizeto atleast23C. Do not use forced heatingmethods to bringthesolder paste up to temperature. Suitable for convection ,IR,hot belt and vapor phase . Proven profiles for multiplecircuitboard configurations. Reflow Profile DATA RANGES The data containedherein may be reported as a typicalvalue and/or a range. Values are based on actual testdata and are verified on a periodic basis . GENERAL INFORMATION For safe handling information on this product, consult the Material Safety Data Sheet (MSDS). Not for Product Specifications The technicalinformationcontained herein is intended for reference only. Please contact Henkel Technologies Technical Service for assistance and recommendations on specificationsfor thisproduct. Conversions (C x 1.8)+ 32 = F Cleaning: kV/mm x 25.4 = V/mil CleaningSolder Paste from Stencils: mm /25.4 = inches m /25.4 = mil LOCTITE GC 10 is a no-cleansolder paste designed to be N x 0.225 = lb lefton thePCB inmany applicationspost assembly itdoes N/mm x 5.71= lb/in not pose a hazard to long-termreliability N/mm x 145 = psi For stencilcleaningand cleaningboard misprints,LOCTITE MPa x 145 = psi MSC 01 solvent cleaneris recommended Nm x 8.851 = lbin . Nm x 0.738= lbft CleaningSolder Paste from Circuit Boards: Nmm x 0.142 = ozin Residues can be removed using conventional cleaning mPas = cP processes based on solvents, such as LOCTITE MCF 800. Cleaningof some assemblies is best conducted in an ultrasonic bath. Tap water is not recommended for rinsing. Ionicimpurities present intap water can lead to reduced reliabilityof the assembly Americas Europe Asia +1.888.943.6535 +32.1457.5611 +86.21.3898.4800 For the most direct access to local sales and technical support visit: www.henkel.com/electronics