Henkel 2105011 is a non-reactive, thermal-curing epoxy adhesive. It has a low viscosity for gap-filling and excellent resistance to heat and shock. It can also be used for structural bonding and also to coat, seal, and encapsulate electronic components. Key features include: fast curing, good impact resistance and dimensional stability, minimal shrinkage and creep, high tensile strength, excellent adhesion to a variety of substrates, and chemical resistance properties. Henkel 2105011 is designed for a variety of applications in various industries, from automotive and electronics, to constructing and bonding in difficult-to-reach-areas.