Technical Data Sheet LOCTITE GC 18 February -2020 PRODUCT DESCRIPTION the solder powder is produced to a quality levelthat exceeds LOCTITEGC 18provides the followingproduct characteristics: IPC/J-STD and EN 29453 requirements forsphericity, size distribution, impurities and oxide levels. Technology Solderpaste Minimum orderrequirements may apply to certain alloys and Application Low voiding ,Halogen-free,Pb-free powder sizes. For availability, contact your local technical soldering service helpdesk. LOCTITEGC 18is a halogen free,no-clean, low voiding, Pb-freesolder paste specially formulated to provide low voiding Particle Size Distribution (PSD) (J-STD- 005A ) when soldering Bottom- Terminated Components (BTC- QFN, Type 3 Powder DPAK and LGA) . This material is also designed to enhance Powder Description T3 stability in printing applications . Powder Particle Size Distribution 25-45 m FEATURES AND BENEFITS Low Voiding:<25% voiding across small and largeBTC Type 4 Powder T4 Powder Description IPCClass IIIvoiding forBGA/CSP Powder Particle Size Distribution 20-38 m Excellent soldering performance Good resistance to graping in demanding reflowprofiles Excellent humidity resistance Solder Paste Typical Properties Minimalslump at room temperature and up to 190C Based on T3 powder Process capability: (Cpk) >2.0forarea ratios down to Metal Content, % 88.5 0.50 Malcom Viscosity 25C ,Pa.s 230 Stable on-stencil viscosity forimproved printing Speed 10 rpm consistency Thixotropic Index 0.51 Reliability:Pass SIRand ECM independent ofreflow IPCSlump A21 ,mm profile 182 C, 10 minutes (0.2mm stencil) Pin-testable post-reflow residues afterfour reflowcycles 0.63x 2.03 mm pads 0.33 Compatibility with approved encapsulant technologies 0.33x 2.03 mm pads 0.20 Stable at room temperature forenhanced sustainability IPCSlump A20 182 C, 10 minutes (0.1mm stencil) 0.33x 2.03 mm pads 0.25 Referto the Engineering Manual forLOCTITEGC 18solder paste foradditional technical information. 0.20x 2.03 mm pads 0.125 Solderballing(IPC2.4.43) afterhumid Preferred storage TYPICAL PROPERTIES LOCTITEGC 18 solder alloys and powders are RoHS and Based on T4 powder EICCcompliant. Metal Content, % 88.5 Malcom Viscosity 25 C ,Pa.s 250 Solder Alloy ( J-STD 006) Speed 10 rpm LOCTITE Code SAC305 Thixotropic Index 0.50 Melting Point (C) 217 IPCSlump A21 ,mm 182 C, 10 minutes (0.2mm stencil) Nominal Composition (% by weight) 0.63x 2.03 mm pads 0.33 Sn 96.5 0.33x 2.03 mm pads 0.20 Ag 3.0 Cu 0.5 IPCSlump A20 182 C, 10 minutes (0.1mm stencil) 0.33x 2.03 mm pads 0.25 Solder Powder 0.20x 2.03 mm pads 0.125 Careful control of the atomization process forproduction of Solderballing(IPC2.4.43) afterhumid Preferred solder powders forLOCTITEGC 18solder paste ensures that storageTDS LOCTITEGC 18, February -2020 RELIABILITY PROPERTIES DIRECTIONS FOR USE Flux Properties: Printing: The flux used in LOCTITEGC 18solder paste contains a Optimum printing results can be achieved using typical stable resin system, slow evaporating solvents and has fabricated stencils and metal squeegees according to the minimal odor.The flux has been tested to the requirements of guidelines mentioned in the Engineering Manual . the J-STD-004 B standard, attaining ROL0 classification . Acceptable print quality has been achieved after printer pause times of 60 minutes and above without requiring a recovery J-STD-004B(IPCTM-650Test Method) Results print (knead) . Copper Mirror(2.3.32D) Pass Surface Insulation Resistance (SIR) (2.6.3.7) Pass Reflow: Flux Corrosion (2.6.15C) Pass Excellent soldering performance is typically achieved using a Electromigration (ECM) (2.6.14.1) Pass convection reflow oven in air.Nitrogen atmosphere reflow can Halogen Content (Pretreatment EN14582,2.3.28.1) Pass be used ifdesired. Flux Activity Classification Pass LOCTITEGC 18solder pastes may be reflowed using a wide range of profiletypes . For optimum soldering and voiding performance a peak temperature of245 to 260C with a time COMPATIBILITY: above liquidus (217C) between 50 to 110 seconds is LOCTITEGC 18 flux residues have been shown to be recommended .Three example profilesare shown which have compatible with encapsulation technologies. demonstrated low voiding in a representative assembly process . LOCTITEGC 18 solder paste is compatible with LOCTITEGC 50 jetting and dispensing solder paste. Further reflow profilescan be reviewed in the Engineering Manual . STORAGE AND SHELF LIFE Reflow Profile Containers: LOCTITEGC 18is supplied in: 500g jars 600g Semco cartridges Customized packaging may be available upon request. Storage: Optimal storage: 5 to 25C (41 to 77F) Please referto the LOCTITEGC 18Handling Guideline for further information on storage conditions. Shelf Life: Provided that LOCTITEGC 18 is stored in the original container, shelflifeof 180days at 5 to 25C (41 to 77F) can be expected. DATA RANGES The data contained hereinmay be reported as a typical value and/or a range. Values are based on actual test data and are verifiedon a Cleaning: periodic basis . LOCTITEGC 18is a no-clean solder paste designed to be left on the PCB, post assembly, without compromising long-term GENERAL INFORMATION reliability. For safe handling information on this product, consult the Material Safety Data Sheet (MSDS). Should there be a specific requirement forresidue removal, Not for Product Specifications this may be achieved using conventional electronic cleaning The technical information contained herein is intended forreference processes based on commercially available cleaning materials only. Please contact Henkel Technologies Technical Service for designed forthe de-fluxing ofelectronic assemblies. assistance and recommendations on specifications forthis product. 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