Technical DataSheet LOCTITE 3621 January -2014 PRODUCT DESCRIPTION 150 LOCTITE3621 providesthefollowing product characteristics: 125 Technology Epoxy ChemicalType Epoxy 100 LMS Appearance (uncured) Red viscousgel Components One component - 75 requiresno mixing Cure Heatcure 50 Application Surface mount adhesive 25 Key Substrates SMD componentstoPCB OtherApplication Areas Small partsbonding 0 DispenseMethod Syringe 20 25 30 35 40 Temperature, C Dispense Speed Very high25,000 -50,000 dots/h Wet Strength High TYPICAL CURING PERFORMANCE LOCTITE3621 isdesignedfor thebonding ofsurfacemounted Recommended conditionsfor curing are exposure toheat devicesto printed circuitboards prior to wave soldering. above 100 C (typically 90-120seconds 150 C). Rateof Particularly suitedfor applicationswhere very high dispense cure and finalstrengthwill depend on theresidencetimeatthe speeds,highdotprofile,highwet strengthand good electrical cure temperature. characteristicsare required .Particularly suitedwhere dispense speeds greater than 35,000 dots/hare required . LOCTITE Cure Speed vs. Time, Temperature 3621 hasbeen used successfullyin lead free processeswith The following graph shows the rate of torque strength water and alcoholbased fluxes under conditionsoutlinedin the developed with timeatdifferenttemperatures.Thesetimesare EnvironmentalResistancesection. defined from the moment the adhesive reaches cure temperature.Inpractice,totaloven timemay be longer toallow TYPICAL PROPERTIES OF UNCURED MATERIAL forheatup period. Strengthismeasured on 1206 capacitors SpecificGravity 25 C 1.22 22 C, testedaccording toIPCSM817,TM-650 Method 2.4.42. LMS Yield Point,25 C, Pa 130 to280 100 Cone & PlateRheometer: HaakePK 100,M10/PK1 2 Cone 150C CassonViscosity 25 C, Pas 0.5 to3 75 Cone & PlateRheometer: HaakePK 100,M10/PK1 2 Cone 125C ParticleSize, m <150 50 FlashPoint-See SDS 100C 25 VISCOSITY VS.TEMPERATURE The following graph shows a typical temperature-viscosity curve asmeasured usinga Haake rotoviscometer PK100, 0 -1 0 30 60 90 120 150 180 210 240 270 300 M10/PK1 2 Cone system ata shear rateof 2 s which is Time at Cure Temperature (seconds) representativeof the shear rate in the dispense nozzle. Increasedcabin or nozzle temperature in the30C to35C Isothermal DSC Conversion range may aid dispense performance at higher dispense LMS 5 minutes 125 C, % 90 speeds. TYPICAL PROPERTIES OF CURED MATERIAL Cured for 30 minutes 150 C Physical Properties : CoefficientofThermal Expansion, -1 ISO11359-2,K : -6 Temperature Range 25 C to70 C 10010 -6 Temperature Range 90 C to150 C 21810 % of Full Strength Viscosity, PasTDS LOCTITE3621, January -2014 CoefficientofThermal Conductivity, ISO8302, 0.3 Hot Strength W/(mK) Testedattemperature Density,BS 5350-B1 25 C, g/cm 1.16 120 GlassTransitionTemperature ,ASTM D 4065 ,C 110 100 Electrical Properties : 15 Volume Resistivity,IEC60093,cm 1.310 80 15 Surface Resistivity,IEC60093, 5210 DielectricBreakdown Strength, 40 60 IEC60243-1,kV/mm ElectrolyticCorrosion,DIN53489 A -1.2 40 DielectricConstant/DissipationFactor,IEC60250 : 1-kHz 2.94/0.005 20 100-kHz 2.87/0.003 1,000-kHz 2.79/0.019 0 25 50 75 100 125 150 175 200 225 250 10,000-kHz 2.76/0.019 Temperature, C Resistance to Hot Solder Dip TYPICAL PERFORMANCE OF CURED MATERIAL Cured for 90 seconds 150 C Adhesive Properties HotSolder Dip, IPCSM817,TM-650 Method 2.4.42.1,Pass/Fail: Cured for 5 minutes 125 C R-1206 on bare FR4 board : Pull-offStrength,Siemensnorm SN59651 : Supported 60 secondsabove solder Pass bath 260C and dipped for 10 C-1206on bare FR4 board N 50 seconds (lb) (13) Torque Strength,IPCSM817,TM-650 Method 2.4.42: C-1206on bare FR4 board Nmm 60 Surface Insulation Resistance (SIR) (in.oz) ( 9.6) LOCTITE3621 meetshigh standards of reliabilityand environmental resistance,such asSIR testingunder electrical biasin high temperature and humidity . The following table Cured for 3 minutes 150 C shows testparameters and resultsof such a testunder Push-offStrength: differentconditions. LMS C-1206on bare FR4 board N 27 SIRTEST Comb Type JIS 3197 Type 2 (IPC B25 (lb) (6.0 ) B-comb) Comb Dimensions 0.38mm lines/space Comb Material bare copper Cured for 30 minutes 150 C Adhesive CoatingThickness 0.1mm Lap Shear Strength,ISO4587: Adhesive Cure 150 C, 30 minutes LMS Mild steel (gritblasted) N/mm 15 Applied Bias Voltage / Test16 V/250 V (psi) (2,175 ) Voltage RelativeHumidity 85% TestTemperature 85C TestDuration 1000 hours 12 Bond strengthachieved in practice will vary considerably InitalComb Resistance 23 C, 910 depending on theSMD component type, adhesivedot size 50% R.H., 6 and the type, grade and degree of cure of the solder FinalComb Resistance 85 C, 37510 85% R.H., mask/resist. 12 FinalComb Resistance 28C, 3.510 50% R.H., TYPICAL ENVIRONMENTAL RESISTANCE Cured for 30 minutes 150 C Resistance to Lead Free Solder Lap Shear Strength,ISO4587: LOCTITE3621 can be used in lead free wave solderwith both Mild steel (gritblasted) water based and alcoholbased fluxes Lead Free Solder Test Conditions Flux Types Multicore MF200 (alcohol based) and MulticoreMF300 (water based) Wave Condition 100C pre-heatwith dual wave at260C Components C1608bonded with twin dot0.8mm SOD 80bonded with singledot1.1mm Result No component lossin thewave GENERAL INFORMATION For safe handling information on this product, consult the Safety Data Sheet (SDS). Americas Europe Asia +1.888.943.6535 +32.1457.5611 +86.21.3898.4800 For the most direct access to local sales and technical support visit: www.henkel.com/electronics % Initial Strength at 22 C