63/37AP Henkel

TECHNICAL SPECIFICATION GROSVENOR PURE ALLOY RAW MATERIALS Grosvenor Pure Alloy Bar Solder is manufactured exclusively from high grade materials. We are aware that re-cycled material can be used, but in our opinion reclaimed scrap metal leaves too many impurities to satisfy the quality demands of Today s Electronics Industry. SPECIFICATIONS. The most common purchasing specification used in the UK is BS 219 (1977/1984). We illustrate below a typical independent analysis of Grosvenor Solder when compared with BS 219. The comparison clearly shows that Grosvenor Solder contains a far lower level of impurities than allowed in the British or other National Standards. (We believe most National standards have to give excessively high impurity levels to allow for the re-cycling of scrap metal. Typical Batch Analysis: High Purity Virgin Tin Sn Sb Pb Cu Zn Fe As Ag Bi In 99.95 0.009 0.002 0.0002 0.0001 0.002 0.002 0.0001 0.0001 0.0003 Typical Batch Analysis: High Purity Virgin Lead. Sn Sb Pb Cu Zn Fe As Ag Bi In 0.001 0.002 99.99 0.003 0.0001 0.002 0.0005 0.002 0.005 0.0003 Typical Batch Analysis: Grosvenor Pure Alloy 63/37 (BS 219) Sn Sb Pb Cu Zn Fe As Ag Bi In 63.5 0.0095 REM 0.0007 0.0002 0.002 0.001 0.0005 0.0003 0.0003 BS 219. 63/37 AP Sn % Sb % Pb % Cu % Zn % Fe % As % Ag % Bi % In % 63 - 64. 0.2 REM 0.08 0.003 0.02 0.03 - 0.1 0.0005 ANALYTICAL SERVICE. A regular check on bath composition and impurity levels is advisable. A full analytical report enables problems to be solved quickly which means a more constant through-put of flow solder production. A 3 monthly check is normally found sufficient, but this depends on workload. DROSS SERVICE. Agitation of solder by wave soldering or dipping will cause oxidisation (known as dross). Dross must be regularly removed and placed carefully into the free of charge containers supplied on request, for return to Grosvenor. SPECIFICATION BS 219 TIN LEAD MELTING RANGE AP 63-64% REM 183-185C KP 59-60% REM 183-188C QQ-S-571E SN63 62.5-63.5% REM 183C SPECIFICATIONS IMPURITY LEVELS. (MAX) KP & AP (MAX) TYPICAL AS SPECIFIED. BS219 QQ-S-571E BS219 QQ-S-571E AP Sn63 AP/KP Sn63 Sb 0.2% 0.2%-0.5% Sb <0.02% <0.2-0.5% Cd 0.005% 0.001% Cd <0.001% <0.001% Bi 0.1% 0.25% Bi <0.005% <0.005% As 0.03% 0.03% As <0.001% <0.001% Fe 0.02% 0.02% Fe <0.001% <0.001% Cu 0.08% 0.08% Cu <0.001% <0.001% Zn 0.003% 0.005% Zn <0.001% <0.001% Al 0.001% 0.005% Al <0.0001% <0.0001% Others 0.08% 0.08% Ag <0.0005% <0.0005% Please refer to Quality Information for a typical Analysis of our AP Bar Solder. TECHNICAL INFORMATION All soldering operations will introduce contaminates to the solder bath. Unfortunately different materials and operations will introduce differing levels of contaminants.Listed are typical contaminants found. Aluminium *: As little as 0.005% may increase dross rate without affecting joint formation. 0.001% may result in a sluggish or gritty solder. Antimony: Certain of the specification require the intentional addition of antimony. Ostensibly this is to retard the transformation of tin into its grey state, sometimes known as tin pest, however this argument no longer appears to have validity in a eutectic or near eutectic alloy. Arsenic: 0.03% can cause dewetting but arsenic is not usually a contaminant in electronic applications Bismuth: 0.5% has been observed to cause discoloration and oxidation of solder, but appreciable amounts of Bismuth would not normally be present in high quality electronic grade alloys or finishes. Cadmium*: At levels of 0.002% joint formulation will be noticeably affected. At 0.005% there will be a high incidence of bridging and icicling, together with a deterioration in joint strength. Copper**: Generally, at levels of 0.25% copper or even less, joint formulation will deteriorate. Gold**: At levels of 0.1% and quite often even less, the solder becomes sluggish and dull joints are formed. Iron: 0.02% of iron can make joint formulation gritty. Sulpher: As little as 0.001% may inhibit wetting and may produce grittiness. Zinc: The presence of Zinc can cause dulling and increase bridging and icicling.0.005% can cause lack of adhesion and grittiness.