Technical Data Sheet LOCTITE LF 318 November -2014 PRODUCT DESCRIPTION Solder Powder: LOCTITE LF 318 provides the following product Careful control of the atomisation process forproduction of characteristics: solder powders forLOCTITE LF 318 solder pastes ensures that the solder powder is produced to a quality level that exceeds IPC/J-STD-006 & EN29453 requirements for Technology Solderpaste sphericity, size distribution, impurities and oxide levels. Application Pb-freesoldering Minimum orderrequirements may apply to certain alloys and powder sizes. LOCTITELF 318 solder paste is a halide-free,no clean, pin testable Pb-freesolder paste, formulated to have excellent DIRECTIONS FOR USE humidity resistance and a broad process window, both for Printing: reflowand printing .This product has a high tack forceto resist 1. LOCTITELF318 is available forstencil printing down to 0.4mm component movement during high speed placement and long (0.016 )pitch devices, with type Type 3 (AGS) powder . printer abandon times . LOCTITE LF 318 shows excellent 2. Printing at speeds between 25mm/s (1.0 /s) and 150mm/s (6 /s) solderability over a wide range ofreflowprofilesin both airand can be achieved by using laser cut and electro-polished ,electro- nitrogen across a wide range of surface finishes including formedstencils ,metal squeegees (preferably60) . Ni/Au,Immersion Sn ,Immersion Ag and OSP copper . 3. Acceptable first prints have been achieved at 0.4mm (0.016 ) pitch after printer down times of240 minutes without requiring a FEATURES AND BENEFITS knead cycle . Good humidity resistance. Gives excellent coalescence Reflow: even after 72 hours exposure to 27C /80% RH, reducing Any ofthe available methods ofheating to cause reflow may be process variation due to environmental factors . used including IR, convection , hot belt, vapor phase and laser Colorless residues foreasy post-reflow inspection . soldering. Soft, non-stick, pin testable residues allow easy in-circuit LOCTITELF318 is not sensitive to reflowprofiletype . testing . No single reflow profileis deemed suitable forallprocesses and Suitable forfinepitch, high speed printing up to 150mm/s ( applications, but the followingexample profileshave given good results in practice . 6/s). Extended open time and tack-lifeleadingto low wastage . Profile 1: Halide-freeflux classification: ROL0 to ANSI/J-STD-004. TYPICAL PROPERTIES Based on Type 3 powder . Solder Paste Typical Properties Alloys 96SC, 97SC Powder Particle Size, m 25-45 Powder Size Coding AGS Metal Loading (Weight %) 88.5 Slump, J-STD-005,mm IPC A21 Pattern RT, 15 minutes 0.33x 2.03mm pads 0.06 0.63 x 2.03mm pads 0.33 150C, 15 minutes 0.33x 2.03mm pads 0.25 0.63 x 2.03mm pads 0.41 BrookfieldViscosity TF spindle, 25C, 5rpm after765,000 2 minutes, mPas Thixotropic Index (Ti),25C 0.54 -1 -1 (Ti=log(viscosity 1.8s /viscosity 18s ) -1 Malcom Rheology, 10rpm, 25C, Rate 6 s 1,961 - Initialtack force,gmm 2.0 Useful open time, hours >24TDS LOCTITELF318, November -2014 Profile 2: DATA RANGES The data contained hereinmay be reported as a typical value and/or a range. Values are based on actual test data and are verifiedon a periodic basis . GENERAL INFORMATION For safe handling information on this product, consult the Material Safety Data Sheet (MSDS). Not for Product Specifications The technical information contained herein is intended forreference only. Please contact Henkel Technologies Technical Service for assistance and recommendations on specifications forthis product. Conversions (C x 1.8)+ 32 =F kV/mm x 25.4=V/mil mm /25.4=inches m /25.4=mil Nx 0.225=lb N/mm x 5.71=lb/in N/mm x 145 =psi Cleaning: MPa x 145 =psi 1. LOCTITELF318 solder pastes are no-clean and are designed to Nm x 8.851 = lbin be lefton the PCB in many applications post-assembly since they Nm x 0.738=lbft do not pose a hazard to long-term reliability. Nmm x 0.142=ozin 2. Residue removal can be achieved using conventional cleaning mPas =cP processes based on solvents such as LOCTITE MCF 800 or suitable saponifying agents . Disclaimer 3. Forstencil cleaning and cleaning board misprints, LOCTITEMSC Note: 01 solvent cleaner is recommended . The information provided in this Technical Data Sheet (TDS) including the recommendations foruse and application of the product are based on our knowledge and experience ofthe product as at the date ofthis TDS. The product RELIABILITY PROPERTIES can have a variety of differentapplications as well as differingapplication and Solder Paste Medium: working conditions in your environment that are beyond our control. Henkel is, LOCTITE LF 318 medium includes a stable resin system with slow therefore,not liableforthe suitability ofour product forthe production processes evaporating solvents and minimal odor. The formulation has been and conditions in respect of which you use them, as well as the intended tested to the requirements of Telcordia (formerlyknown as Bellcore) applications and results. We strongly recommend that you carry out your own priortrials to confirm such suitability ofour product. GR-78-CORE and ANSI/J-STD-004B for a type ROL0 classification Any liabilityin respect ofthe information in the Technical Data Sheet or any other specification . written or oralrecommendation(s) regarding the concerned product is excluded, except ifotherwise explicitly agreed and except in relation to death or personal injury caused by our negligence and any liabilityunder any applicable mandatory Test Specification Results product liabilitylaw. Copper Plate Corrosion ANSI/J-STD-004 Pass Copper MirrorCorrosion ANSI/J-STD-004 Pass In case products are delivered by Henkel Belgium NV, Henkel Electronic Materials NV,Henkel Nederland BV,Henkel Technologies France SAS and Chlorides & Bromides ANSI/J-STD-004 Pass Henkel France SA please additionally note the following: Surface Insulation ANSI/J-STD-004 Pass In case Henkel would be nevertheless held liable,on whatever legalground, Resistance (without TelcordiaGR-78-Core Pass Henkels liabilitywillin no event exceed the amount ofthe concerned delivery. cleaning) JIS-Z-3248 Pass In case products are delivered by Henkel Colombiana, S.A.S.the following Flux Activity Classification ANSI/J-STD-004 ROL0 disclaimer is applicable: (without cleaning) The information provided in this Technical Data Sheet (TDS) including the recommendations foruse and application of the product are based on our knowledge and experience ofthe product as at the date ofthis TDS. Henkel is, therefore,not liableforthe suitability ofour product forthe production processes STORAGE AND SHELF LIFE and conditions in respect of which you use them, as well as the intended Storage: applications and results. We strongly recommend that you carry out your own It is recommended to store LOCTITE LF 318 at 0 to 10C . (NB priortrials to confirm such suitability ofour product. cartridges should be stored tip down to prevent the formation of air Any liabilityin respect ofthe information in the Technical Data Sheet or any other pockets). The paste should be removed fromcold storage a minimum written or oralrecommendation(s) regarding the concerned product is excluded, of 8 hours beforeuse . Do not use forced heating methods to bring except ifotherwise explicitly agreed and except in relation to death or personal injury caused by our negligence and any liabilityunder any applicable mandatory solder paste up to temperature . LOCTITELF318 has been formulated product liabilitylaw. to minimize flux seperation on storage but should this occur, gentle stirring for15 seconds willreturn the product to it s correct rheological In case products are delivered by Henkel Corporation, Resin Technology performance. To prevent contamination of unused product, do not Group, Inc., or Henkel Canada Corporation, the following disclaimer is return any material to its originalcontainer. Forfurther specific shelflife applicable: information, contact your localTechnical Service Center. The data contained herein are furnished forinformation only and are believed to be reliable.We cannot assume responsibility forthe results obtained by others Shelf Life: over whose methods we have no control. It is the user s responsibility to determine suitability forthe user s purpose ofany production methods mentioned Provided LOCTITE LF 318 is stored tighly sealed in its original herein and to adopt such precautions as may be advisable forthe protection of container at 0 to 10C, a minimum shelf lifeof 183 days can be property and ofpersons against any hazards that may be involved in the handling expected. Airshipment is recommended to minimize the time the and use thereof. In light of the foregoing,Henkel Corporation specifically containers are exposed to highertemperatures. disclaims all warranties expressed or implied, including warranties of merchantability or fitness for a particular purpose, arising from sale or use Americas Europe Asia 1.888.943.6535 +32.1457.5611 +86.21.3898.4800 For the most direct access to local sales and technical support visit: www.henkel.com/electronics