Gap Pad VO July 2011 PRODUCT DESCRIPTION TYPICAL PROPERTIES OF GAP PAD VO Conformable,Thermally Conductive PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD Material for Filling Air Gaps Color Gold/Pink Gold/Pink Visual FEATURES AND BENEFITS Reinforcement Carrier Sil-Pad Sil-Pad Thermal conductivity: 0.8 W/m-K Thickness (inch) / (mm) 0.020 to 0.250 0.508 to 6.350 ASTM D374 Inherent Surface Tack (1 sided) 1 1 Enhanced puncture, shear and tear resistance Density (Bulk Rubber) (g/cc) 1.6 1.6 ASTM D792 Heat Capacity (J/g-K) 1.0 1.0 ASTM E1269 Conformable gap filling material Hardness (BulkRubber) (Shore 00) (1) 40 40 ASTM D2240 Electrically isolating Young s Modulus (psi) / (kPa) (2) 100 689 ASTM D575 Continuous Use Temp (F) / (C) -76 to 392 -60 to 200 ELECTRICAL Dielectric Breakdown Voltage (Vac) >6000 >6000 ASTM D149 Dielectric Constant (1000 Hz) 5.5 5.5 ASTM D150 11 11 Volume Resistivity (Ohm-meter) 10 10 ASTM D257 Flame Rating V-O V-O U.L. 94 THERMAL Thermal Conductivity (W/m-K) 0.8 0.8 ASTM D5470 THERMAL PERFORMANCE vs. STRAIN Deflection (% strain) 10 20 30 2 Thermal Impedance (C-in /W) 0.040 (3) 2.47 2.37 2.24 Gap Pad VO is a cost-effective, thermally 1) Thirty second delay value Shore 00 hardness scale. 2)Youngs Modulus, calculated using 0.01 in/min.step rate of strain conductive interface material.The material 2 with a sample size of 0.79 inch . 3) The ASTM D5470 test fixture was used.The recorded value includes interfacial ther- is a filled, thermally conductive polymer mal resistance. These values are provided for reference only. Actual application performance is directly related to the sur- face roughness,flatness and pressure applied. supplied on a rubber-coated fiberglass carrier allowing for easy material TYPICAL APPLICATIONS INCLUDE handling.The conformable nature of Gap Pad VO allows the pad to fill in air Telecommunications gaps between PC boards and heat sinks Computer and peripherals or a metal chassis. Power conversion Note: To build a part number, visit our Between heat-generating semiconductors or website at www.bergquistcompany.com. magnetic components and a heat sink Area where heat needs to be transferred to a frame, chassis, or other type of heat spreader CONFIGURATIONS AVAILABLE Sheet form and die-cut parts Thickness vs. Thermal Resistance Gap Pad VO 250 200 150 100 50 0 1 3 5 7 9 11 13 2 Thermal Resistance (C-in /W) PDS GP VO 0711 Resultant Thickness (mils) TDS Gap Pad VO, July 2011 Disclaimer Note: The information provided in this Technical Data Sheet (TDS) including the recommendations for use and application of the product are based on our knowledge and experience of the product as at the date of this TDS. The product can have a variety of different applications as well as differing application and working conditions in your environment that are beyond our control. Henkel is, therefore, not liable for the suitability of our product for the production processes and conditions in respect of which you use them, as well as the intended applications and results. We strongly recommend that you carry out your own prior trials to confirm such suitability of our product. Any liability in respect of the information in the Technical Data Sheet or any other written or oral recommendation(s) regarding the concerned product is excluded, except if otherwise explicitly agreed and except in relation to death or personal injury caused by our negligence and any liability under any applicable mandatory product liability law. In case products are delivered by Henkel Belgium NV, Henkel Electronic Materials NV, Henkel Nederland BV, Henkel Technologies France SAS and Henkel France SA please additionally note the following: In case Henkel would be never theless held liable, on whatever legal ground, Henkels liabilit y will in no event exceed the amount of the concerned deliver y. In case products are delivered by Henkel Colombiana, S.A.S. the following disclaimer is applicable: The information provided in this Technical Data Sheet (TDS) including the recommendations for use and application of the product are based on our knowledge and experience of the product as at the date of this TDS. Henkel is, therefore, not liable for the suitability of our product for the production processes and conditions in respect of which you use them, as well as the intended applications and results. We strongly recommend that you carry out your own prior trials to confirm such suitability of our product. Any liability in respect of the information in the Technical Data Sheet or any other written or oral recommendation(s) regarding the concerned product is excluded, except if otherwise explicitly agreed and except in relation to death or personal injury caused by our negligence and any liability under any applicable mandatory product liability law. In case products are delivered by Henkel Corporation, Resin Technology Group, Inc., or Henkel Canada Corporation, the following disclaimer is applicable: The data contained herein are furnished for information only and are believed to be reliable. We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the users responsibility to determine suitability for the users purpose of any production methods mentioned herein and to adopt such precautions as may be advisable for the protection of property and of persons against any hazards that may be involved in the handling and use thereof. In light of the foregoing, Henkel Corporation specifically disclaims all warranties expressed or implied, including warranties of merchantability or fitness for a particular purpose, arising from sale or use of Henkel Corporations products. Henkel Corporation specifically disclaims any liability for consequential or incidental damages of any kind, including lost profits. The discussion herein of various processes or compositions is not to be interpreted as representation that they are free from domination of patents owned by others or as a license under any Henkel Corporation patents that may cover such processes or compositions. We recommend that each prospective user test his proposed application before repetitive use, using this data as a guide. This product may be covered by one or more United States or foreign patents or patent applications. 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