SEL SP 0906 Chpt1.qxp 10/20/2006 4:13 PM Page 1 Table of Contents Introduction 2 Sil-Pad Thermally Conductive Insulators 45 Thermal Properties and Testing 4 Sil-Pad Comparison Data 46 Interface Material Selection Guide 5 Frequently Asked Questions 47 Gap Pad Thermally Conductive Materials 6 Choosing Sil-Pad Thermally Conductive Insulators 48 Gap Pad Comparison Data 7 Mechanical, Electrical and Thermal Properties 50 Frequently Asked Questions 8 Sil-Pad Applications 52 Gap Pad VO 9 Sil-Pad Selection Table 52 Gap Pad VO Soft 10 Sil-Pad 400 54 Gap Pad VO Ultra Soft 11 Sil-Pad 800 55 Gap Pad 1000SF 12 Sil-Pad 900S 56 Gap Pad HC1000 13 Sil-Pad 980 57 Gap Pad 1500 14 Sil-Pad 1100ST 58 Gap Pad 1500R 15 Sil-Pad A1500 59 Gap Pad A2000 16 Sil-Pad 1500ST 60 Gap Pad 2000S40 17 Sil-Pad 1750 61 Gap Pad 2500S20 18 Sil-Pad 2000 62 Gap Pad 2500 19 Sil-Pad A2000 63 Gap Pad A3000 20 Sil-Pad K-4 64 Gap Pad 3000S30 21 Sil-Pad K-6 65 Gap Pad 5000S35 22 Sil-Pad K-10 66 ( ) Gap Filler 1000 Two-Part 23 Q-Pad II 67 ( ) Gap Filler 1100SF Two-Part 24 Q-Pad 3 68 Gap Filler Gel 1500 (One-Part) 25 Poly-Pad 400 69 ()26 Gap Filler 2000 Two-Part Poly-Pad 1000 70 Gap Filler 3500S35 (Two-Part) 27 Poly-Pad K-4 71 TIC Thermal Interface Compound 28 Poly-Pad K-10 72 Comparison Data and Frequently Asked Questions 28 Sil-Pad Tubes 73 TIC 1000G 29 Sil-Pad Shield 74 TIC 1000A 30 Bond-Ply and Liqui-Bond Adhesives 75 TIC 4000 31 Bond-Ply and Liqui-Bond Comparison Data 76 Hi-Flow Phase Change Interface Materials 32 Frequently Asked Questions 76 Hi-Flow Comparison Data 33 Bond-Ply 100 77 Frequently Asked Questions 34 Bond-Ply 400 78 Hi-Flow 105 35 Bond-Ply 660B 79 Hi-Flow 115-AC 36 Liqui-Bond SA 1000 (One-Part) 80 ( ) Hi-Flow 225F-AC 37 Liqui-Bond SA 2000 One-Part 81 Hi-Flow 225FT 38 Solutions for Surface Mount Applications 83 Hi-Flow 225UF 39 Ordering Information 85 Hi-Flow 225UT 40 Sil-Pad Configurations - Imperial 87 Hi-Flow 225U 41 Hi-Flow Configurations - Imperial 90 Hi-Flow 625 42 Sil-Pad Configurations - Metric 91 Hi-Flow 300P 43 Hi-Flow Configurations - Metric 94 Hi-Flow 300G 44 Sil-Pad Shield Configurations - Imperial 95 1SEL SP 0906 Chpt1.qxp 10/20/2006 10:18 AM Page 2 World Leader in Thermal Management Through Technology, Innovation and Service At Bergquist, developing high quality Bergquist Takes World Class Operations the Heat Around the Globe components for the electronics industry is our first priority. As a world-leading manufacturer with state-of-the-art facilities, we serve a multitude of industries worldwide including automotive, computer, consumer electronics, military, motor control, power conversion, telecommunications and more. Thermal Management Products Worldwide Locations We make it our business to know Bergquist s Thermal Products Group is a world- In the United States, the Thermal Products leading developer and manufacturer of thermal Groups 90,000 square-foot manufacturing your business. We understand your management materials which provide product facility is located in Cannon Falls, Minnesota. problems. We also know that there solutions to control and manage heat in A 40,000 square-foot facility in Prescott, electronic assemblies and printed circuit Wisconsin houses the Thermal Clad printed will always be a better way to help boards. Used by many of the worlds largest circuit board operations. A130,000 square- you reach your goals and objectives. OEMs in various industries including auto- foot facility in Chanhassen, Minnesota is the motive, computer, power supply, military and location for Bergquists corporate headquarters To that end, our company continually motor control, these materials include: and state-of-the-art research and development invests considerable time and money facilities.Worldwide, Bergquist has facilities in Sil-Pad Thermally Conductive Insulators The Netherlands, Germany, the United into research and development. The Bond-Ply and Liqui-Bond Thermally Kingdom,Taiwan, South Korea, Hong Kong Bergquist Company is focused on a Conductive Adhesives and China with sales representatives in 30 Gap Pad Thermally Conductive countries to support worldwide growth. single purpose discovering the Gap Filling Materials need, then developing and delivering Hi-Flow Phase Change Interface Materials technologically advanced solutions TIC Thermal Interface Compounds backed by superior service. Thermal Clad Insulated Metal Substrates 2 INTRODUCTION