Hi-Flow 225F-AC Reinforced, Phase Change Thermal Interface Material Features and Benefits TYPICAL PROPERTIES OF HI-FLOW 225F-AC PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD Thermal impedance: 2 Color Black Black Visual 0.10C-in /W ( 25 psi) Reinforcement Carrier Aluminum Aluminum Can be manually or automatically applied Thickness (inch) / (mm) 0.004 0.102 ASTM D374 to the surfaces of room-temperature Carrier Thickness (inch) / (mm) 0.0015 0.038 ASTM D374 heat sinks Continuous Use Temp (F) / (C) 248 120 Foil reinforced, adhesive-coated Phase Change Temp (F) / (C) 131 55 ASTM D3418 Soft, thermally conductive 55C phase ELECTRICAL change compound Flame Rating V-O V-O U.L. 94 THERMAL Thermal Conductivity (W/m-K) (1) 1.0 1.0 ASTM D5470 THERMAL PERFORMANCE vs PRESSURE Pressure (psi) 10 25 50 100 200 TO-220 Thermal Performance (C/W) 0.87 0.68 0.57 0.50 0.45 2 Thermal Impedance (C-in /W) (2) 0.12 0.10 0.09 0.08 0.07 1) This is the measured thermal conductivity of the Hi-Flow coating. It represents one conducting layer in a three-layer laminate.The Hi-Flow coatings are phase change compounds.These layers will respond to heat and pressure induced stresses.The overall conductivity of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied.This characteristic is not accounted for in ASTM D5470. Please contact Bergquist Product Management if additional specifications are required. 2) The ASTM D5470 test fixture was used and the test sample was conditioned at 70C prior to test.The recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. Hi-Flow 225F-AC is a high performance, Typical Applications Include: thermal interface material for use between a computer processor and a heat sink. Hi-Flow Computer and peripherals 225F-AC consists of a soft, thermally Power conversion conductive 55C phase change compound High performance computer processors coated to the top surface of an aluminum Power semiconductors carrier with a soft, thermally conductive adhesive compound coated to the bottom Power modules surface to improve adhesion to the heat sink. Configurations Available: Above the 55C phase change temperature, Roll form, kiss-cut parts, and sheet form Hi-Flow 225F-AC wets-out the thermal interface surfaces and flows to produce low Building a Part Number Standard Options thermal impedance. HF225FAC0.004 AC 11/250 NA Hi-Flow 225F-AC requires pressure from the NA = Selected standard option. If not selecting a standard assembly to cause material flow.The Hi-Flow option, insert company name, drawing number, and revision level. coatings resist dripping in vertical orientation. = Standard configuration dash number, 1112 = 11 x 12 sheets, 11/250 = 11 x 250 rolls, or The material includes a base carrier liner with 00 = custom configuration differential release properties to facilitate AC = Adhesive, one side simplicity in roll form packaging and application Standard thicknesses available: 0.004 assembly. Please contact Bergquist Product Management for applications that are less than HF225FAC = Hi-Flow 225F-AC Phase Change Material 0.07 square. Note: To build a part number, visit our website at www.bergquistcompany.com. Hi- Flow : U.S. Patent 6,197,859 and others All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES, EXPRESSED OR IMPLIED, INCLUDING THE IMPLIED www.bergquistcompany.com WARRANTIES OF MARKETABILITY AND FITNESS FOR PURPOSE. Sellers and manufacturers only obligation shall be to replace such quantity of the product proved to be defective. Before using, user shall determine the suitability of the product The Bergquist Company - The Bergquist Company - The Bergquist Company - Asia for its intended use, and the user assumes all risks and liability whatsoever in connection therewith. 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Fax: 952-835-0430 Fax: 31-35-5380295 Fax: 852.2690.2344 PDS HF 225 FAC 12.08 Section A Section B Section C Section D Section EX-ON Electronics Largest Supplier of Electrical and Electronic Components Click to view similar products for bergquist company manufacturer: Other Similar products are found below : SIL-PAD 2000 150MMX150MM SHEET GP2000S40-0.040-02-4/4 GPEMI1.0-0.060-01-0816 SPA2000-0.020-00-1012 TGP6000ULM- 0.125-12-0816 803265 GPEMI1.0-0.040-01-0816 GP3500ULM-G-0.100-12-0816 TGP12000ULM-0.080-00-0808 GP1500-0.160-02-0816 TGP3000ULM-0.080-02-0816 SIL-PAD K6 300MMX300MM SHEET GP1500-0.200-02-0816 SP980-0.009-00-1212 GPEMI1.0- 0.100-01-0816 GPA3000-0.125-01-0816 TGP12000ULM-0.100-00-0808 TGP12000ULM-0.060-00-0808 TGP3000ULM-0.120-02-0816 803263 GP1000SF-0.100-02-0816 GPHC1000-0.010-02-0816 GP1500S30-0.100-02-0816 LF2000-00-00-30CC TGP3000ULM- 0.100-02-0816 TGP12000ULM-0.125-00-0808 803269 2015-54 GPVOUS-0.080-00-4/4 SP1200-0.016-AC-1212 HF625-0.005-AC-1212 SPA1500-0.010-00-4/4 GP1500S30-0.250-02-0816 SPA2000-0.015-AC-1012 GP3500ULM-G-0.080-12-0816 GPVO-0.160-01-0816 GP1500S30-0.125-02-0816 BP660P-0.008-00-1112 LF3800LVO-00-150CC 803790 803266 BP100-0.005-00-1/1 SP1200-0.012-AC-1212 SP1500ST-0.012-02-1012 GP3500ULM-0.100-02-0816 GF2000-00-600-50CC 803262 GPVOUS-0.160-AC-0816 GPVOUS-B- 0.040-01-0816 803268