Product Data Sheet Product NO CLEAN DESOLDERING WICK May 2003 Faster and increased solder absorption Heat stable coating Vacuum packed Wound on static dissipative spools PCBs will meet MIL-P-28809A Excellent shelf life Cleanliness Test without cleaning Negligible residues which are non-corrosive, New size No Clean Microwick (NC-MW) for SMD clear and non-hygroscopic replacement NOT FOR PRODUCT SPECIFICATIONS. THE TECHNICAL INFORMATION CONTAINED HEREIN IS INTENDED AS REFERENCE ONLY. PLEASE CONTACT LOCTITE CORPORATION QUALITY DEPARTMENT FOR ASSISTANCE AND RECOMMENDATIONS ON SPECIFICATIONS FOR THIS. NO CLEAN DESOLDERING WICK, May 2003 PACKAGING DESCRIPTION Multicore No Clean Wick is supplied in static dissipative plastic A new No Clean Desoldering Wick designed for static-free spools of 1.5m (5 ft) each. This provides convenient application desoldering and repair of PC boards without the need for and protects the user from heat. subsequent cleaning. Packaged ten static dissipative spools per vacuum packed sleeve Multicore No Clean Wick uses a special halide-free vacuumised and five sleeves per box for a total of fifty spools per carton. Also no-clean, flux-coated copper braid designed to improve wicking. available in 100 ft Econo-spools. It will not lose its efficiency even after prolonged storage in humid conditions. The wick remains flexible and will not flake. PC Size Approximate Label Colour boards meet MIL-P-28809A Cleanliness Test without cleaning. Reference Width Code NC-MW 0.5mm (0.02in) Orange NC-00 0.8mm (0.03in) White Multicore No Clean Wick is available in five sizes, including a NC-AA 1.5mm (0.06in) Yellow Microwick size (NC-MW) for SMD replacement. Each size has colour coded packaging for easy identification and is supplied on NC-AB 2.2mm (0.08in) Green 1.5m or 3m static dissipative spools meeting DOD standards. NC-BB 2.7mm (0.10in) Blue APPLICATION SHELF LIFE Lay Multicore No Clean Wick over the solder requiring removal Due to the nature of the Xersin 2005 flux coating, Multicore No and place the soldering iron tip on top of the copper braid. The Clean Wick does not lose its efficiency even after prolonged braid and solder beneath will gradually heat until the solder melts storage in humid conditions, whereas conventional rosin coated and is absorbed into the braid by capillary action. Remove the wicks may lose their efficiency under such conditions. braid, cut off the solder-filled length and dispose of lead contaminated copper properly. HEALTH AND SAFETY Sudden heat shock, which may be produced when using a preheated vaccum desoldering tool, is prevented since the braid WARNING: The following information is for guidance only and is cold when it first comes into contact with the joint to be users must refer to the Material Safety Data Sheet relevant to desoldered. Multicore No Clean Desoldering Wick before use. Fume Hazards and Precautions: The fumes evolved during SPECIAL PROPERTIES use may irritate the nose and respiratory organs of some sensitive subjects. Avoid excessive inhalation of the fumes. Multicore No Clean Wick is supplied on static dissipative spools Suitable fume extraction equipment should be used to extract conforming to both (DOD) Standard 1686 and DOD Handbook fumes away from the operators. When used at normal soldering 263 for static discharge protection and meets the decay rate temperatures the amount of lead fume given off is negligible. provision of MIL-B-81705B. Protection and Hygiene: Eating, drinking and smoking should Specially processed copper braid is coated with a reduced not be permitted in the working area. Hands should be washed volume of time tested Xersin 2005 halide free synthetic resin, so with soap and warm water after handling this product, especially that the quantity of residue after use is significantly less than with before eating. conventional desoldering wick. Xersin 2005 meets Bellcore TR- TSY 000078 issue 2, ANSI/IPC SF-818 and is rated IPC-LR3CN. Waste Disposal: Waste material should be disposed of in accordance with local regulations. PCBs will pass the MIL-P-28809A Cleanliness Test without cleaning, provided a No Clean flux and a clean system and Note components are used. PCBs will also pass this test if they have been cleaned after the soldering operation, provided they have The data contained herein are furnished for information only and are been reworked using a No Clean flux in a clean environment. believed to be reliable. We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user s responsibility to determine suitability for the user s purpose of any production methods mentioned herein and to adopt such precautions as may be advisable for the protection of property and of persons against any hazards that may be involved in the handling and use thereof. In light of the foregoing, Loctite Corporation specifically disclaims all warranties expressed or implied, including warranties of merchantability or fitness for a particular purpose, arising from sale or use of Loctite Corporations products. Loctite Corporation specifically disclaims any liability for consequential or incidental damages of any kind, including lost profits. The discussion herein of various processes or compositions is not to be interpreted as representation that they are free from domination of patents owned by others or as a license under any Loctite Corporation patents that may cover such processes or compositions. We recommend that each prospective user test his proposed application before repetitive use, using this data as a guide. This product may be covered by one or more United States or foreign patents or patent applications. Loctite Electronics Henkel Loctite UK Ltd, Watchmead, Welwyn Garden City, Hertfordshire, AL7 1JB, England UK.: 01707 358800 MSL525 Loctite is a Trademark of Henkel Loctite Corp. U.S.A www.loctite.com