X-On Electronics has gained recognition as a prominent supplier of BCM20737A1KML2G RF System on a Chip - SoC across the USA, India, Europe, Australia, and various other global locations. BCM20737A1KML2G RF System on a Chip - SoC are a product manufactured by Infineon. We provide cost-effective solutions for RF System on a Chip - SoC, ensuring timely deliveries around the world.

BCM20737A1KML2G Infineon

BCM20737A1KML2G electronic component of Infineon
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See Product Specifications
Part No.BCM20737A1KML2G
Manufacturer: Infineon
Category: RF System on a Chip - SoC
Description: RF System on a Chip - SoC Single-Chip BT
Datasheet: BCM20737A1KML2G Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 1.3112 ea
Line Total: USD 1.31 
Availability - 475
Ship by Fri. 08 Nov to Thu. 14 Nov
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
475
Ship by Fri. 08 Nov to Thu. 14 Nov
MOQ : 1
Multiples : 1
1 : USD 1.3112

475
Ship by Fri. 08 Nov to Thu. 14 Nov
MOQ : 6
Multiples : 1
6 : USD 1.3112

   
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We are delighted to provide the BCM20737A1KML2G from our RF System on a Chip - SoC category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the BCM20737A1KML2G and other electronic components in the RF System on a Chip - SoC category and beyond.

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The following document contains information on Cypress products. Although the document is marked with the name Broadcom, the company that originally developed the specification, Cypress will continue to offer these products to new and existing customers. CONTINUITY OF SPECIFICATIONS There is no change to this document as a result of offering the device as a Cypress product. Any changes that have been made are the result of normal document improvements and are noted in the document history page, where supported. Future revisions will occur when appropriate, and changes will be noted in a document history page. CONTINUITY OF ORDERING PART NUMBERS Cypress continues to support existing part numbers. To order these products, please use only the Ordering Part Numbers listed in this document. FOR MORE INFORMATION Please visit our website at www.cypress.com or contact your local sales office for additional information about Cypress products and services. OUR CUSTOMERS Cypress is for true innovators in companies both large and small. Our customers are smart, aggressive, out-of-the-box thinkers who design and develop game-changing products that revolutionize their industries or create new industries with products and solutions that nobody ever thought of before. ABOUT CYPRESS Founded in 1982, Cypress is the leader in advanced embedded system solutions for the worlds most innovative automotive, industrial, home automation and appliances, consumer electronics and medical products. Cypresss programmable systems-on-chip, general-purpose microcontrollers, analog ICs, wireless and USB-based connectivity solutions and reliable, high-performance memories help engineers design differentiated products and get them to market first. Cypress is committed to providing customers with the best support and engineering resources on the planet enabling innovators and out-of-the-box thinkers to disrupt markets and create new product categories in record time. To learn more, go to www.cypress.com. Cypress Semiconductor Corporation 198 Champion Court San Jose, CA 95134-1709 408-943-2600 Document Number: 002-16365 Rev. ** Revised August 31, 2016 Data Sheet BCM20737 Single-Chip Bluetooth Low Energy-Only System-On-Chip with Support for Wireless Charging GENERAL DESCRIPTION FEATURES The Broadcom BCM20737 is an advanced Alliance for Wireless Power (A4WP) wireless Bluetooth low energy (aka Bluetooth Smart) SoC that charging supports wireless charging, includes advanced Support for RSA encryption/decryption and key security features and introduces new software exchange mechanisms (up to 4 kbit) support for NFC pairing. The BCM20737 is designed Support for X.509 certificate exchange to support the entire spectrum of Bluetooth Smart use cases for the medical, home automation, accessory, Support for NFC tag-based tap-to-pai sensor, Internet Of Things, and wearable market Support for Bluetooth Smart Based Audio segments. Bluetooth low energy (BLE)-compliant The BCM20737 radio has been designed to provide Infrared modulator low power, low cost, and robust communications for IR learning applications operating in the globally available Supports Adaptive Frequency Hopping 2.4 GHz unlicensed Industrial, Scientific, and Medical Excellent receiver sensitivity (ISM) band. 10-bit auxiliary ADC with nine analog channels On-chip support for serial peripheral interface The single-chip Bluetooth low energy SoC is a monolithic component implemented in a standard (master and slave modes) digital CMOS process and requires minimal external Broadcom Serial Communications interface components to make a fully compliant Bluetooth 2 (compatible with Philips I C slaves) device. The BCM20737 is available in a 32-pin, Programmable output power control 5 mm 5 mm 32-QFN package as well as WLBGA Integrated ARM Cortex-M3 based SIP and die packages. microprocessor core APPLICATIONS Automation Profile a The following profiles are supported in ROM: Support for secure OTA Battery status On-chip power-on reset (POR) Blood pressure monitor Support for EEPROM and serial flash interfaces Find me Integrated low-dropout regulator (LDO) Heart rate monitor On-chip software controlled power management unit Proximity Package type: Thermometer - 32-pin 32-QFN package (5 mm 5 mm) Weight scale RoHS compliant Time a Additional profiles that can be supported from RAM include: Blood glucose monitor Temperature alarm Location a.Full qualification and use of these profiles may require FW updates from Broadcom. Some of these profiles are under development/approval at the Bluetooth SIG and conformity with the final approved version is pending. Contact your supplier for updates and the latest list of profiles. 20737-DS102-R 5300 California Avenue Irvine, CA 92617 Phone: 949-926-5000 Fax: 949-926-5203 August 17, 2016

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8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
Cypress
Cypress / Spansion
CYPRESS SEMI
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Cypress Semiconductor
Cypress Semiconductor Corp
INF
INFINEON
Infineon IR
INFINEON (CYPRESS)
Infineon (IRF)
Infineon / Cypress
Infineon / IR
INFINEON TECH ICs
Infineon Technologies
INFINEON TECHNOLOGIES AG
Infineon Technologies Americas Corp.
Infinite Power Solutions
INTERNATIONAL RECTIF
INTERNATIONAL RECTIFIER
International Rectifier HiRel Products
INTL RECTIFIER
IR
IRH
Ramtron
Ramtron / Cypress Semiconductor
Ramtron International Corp
SP9
SPANSION
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