Product Brief 45nm Intel Xeon Processors Embedded Computing 45nm Intel Xeon Processors 5400/5200 Series for Embedded Computing Platforms Boost performance and energy efficiency for full-performance and bladed platforms Product Overview 2.5 27% SPECint base2000 These Intel Xeon processors, with extended lifecycle support, Performance 1 Increase 23198 utilize Intels Hafnium-based 45nm Hi-k silicon process tech- 2.0 SPECint base2000 nology to reduce power consumption, increase switching speed, 18298 and significantly increase transistor density over previous 65nm 1.5 technology to 820 million transistors. The Intel Xeon proces- SPECfp base2000 1 sor E5440 delivers a 27% performance gain within the same 12898 SPECfp base2000 thermal profile over the previous-generation Intel Xeon processor 1.0 98 E5345 (see Figure 1), making it an excellent choice for compute- intensive embedded, storage and communications applications. 0.5 Lower thermal design power (TDP) and higher Tcase temperature options are ideal for low-power consumption and/or compliance Intel Xeon Intel Xeon with the AdvancedTCA* form factor and NEBS level-3 thermal Processor E5345 Processor E5440 2.33 GHz (65nm) 2.83 GHz (45nm) specifications. The quad-core 5400 series supports 12 MB on- die L2 cache (2x6 MB) and the dual-core 5200 series supports 6 MB on-die L2 cache. All processors integrate Intel Virtual- Figure 1: Performance improvements of the 45nm Intel Xeon 2 3 ization Technology (Intel VT), Intel 64 architecture, processor in dual-processing configuration (eight cores per system). Intel VT FlexMigration, and Intel VT FlexPriority. These quad- and dual-core processors utilize a common microarchitecture and common socket with the previous- generation Intel Xeon processor 5300 series and 5100 series, providing a simplified path to upgrades.Platform Configurations These 45nm processors are validated with two different chipsets, providing a choice of flexible, dual-processor-capable platforms for a wide range of applications. These include storage area networks, network attached storage, routers, IP-PBX, converged/unified communications platforms, sophisticated content firewalls, unified threat management systems, medical imaging equipment, military signal and image processing, and telecommunications (wireless and wireline) servers. I ntel 5000P chipset-based platforms are ideal for full Intel 5100 Memory Controller Hub (MCH) chipset-based performance and memory-intense applications by providing platforms are ideal for bladed and dense bladed applications a maximum FB-DIMM memory capacity of 64 GB, 28 lanes of requiring less than 200 watts, including AdvancedTCA* and PCI Express* , and accelerated I/O options. This platform offers NEBS-compliant solutions. Platform power savings is derived quick migration for customers with existing Intel 5000P from lower TDP in the MCH (25.7 watts TDP at 1333 MHz chipset-based designs due to the LGA 771 socket, common front-side bus FSB and 23.0 watts TDP at 1066 MHz FSB), with the quad-core 5300 series and dual-core 5100 series, the efficient next-generation Intel I/O Controller Hub 9R at eliminating software tuning and minimizing hardware 4.3W TDP, and standard native DDR2 memory technology qualification efforts (see Figure 2). with a maximum capacity of 48 GB (see Figure 3). Intel Xeon Intel Xeon Intel Xeon Intel Xeon Processor 5400 Processor 5400 Processor 5400 Processor 5400 or 5200 Series or 5200 Series or 5200 Series or 5200 Series Up to 2x Up to 2x 1333 MHz 1333 MHz DDR2 FB-DIMM Intel I/O Controller Hub 9R DDR2 FB-DIMM DDR2 533/667 Intel 5000P Intel Intel 5100 6321ESB Memory Memory I/O Controller Hub Controller Controller Hub DDR2 FB-DIMM DDR2 533/667 Hub Congurable up to DDR2 FB-DIMM 48 GB max memory 6 PCI Express* lanes congurable as 1 x4 Congurable PCI Express* or 6 x1 wide links with 28 lanes Congurable up to 64 GB max memory 24 PCI Express lanes congurable as x4, x8, or x16 wide links Figure 2: Intel 5000P chipset-based platforms Figure 3: Intel 5100 Memory Controller Hub chipset-based platforms 2