X-On Electronics has gained recognition as a prominent supplier of LE80537LG0254MS LAET CPU - Central Processing Units across the USA, India, Europe, Australia, and various other global locations. LE80537LG0254MS LAET CPU - Central Processing Units are a product manufactured by Intel. We provide cost-effective solutions for CPU - Central Processing Units, ensuring timely deliveries around the world.

LE80537LG0254MS LAET Intel

LE80537LG0254MS LAET electronic component of Intel
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Part No.LE80537LG0254MS LAET
Manufacturer: Intel
Category: CPU - Central Processing Units
Description: CPU - Central Processing Units Core 2 L7500 Dual Core 1.6GHz PBGA479
Datasheet: LE80537LG0254MS LAET Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
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Obsolete
Availability Price Quantity
0
MOQ : 1
Multiples : 1
1 : USD 376.0336
2 : USD 376.0336
5 : USD 373.2298
10 : USD 361.5707
25 : USD 357.105
N/A

Obsolete
   
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We are delighted to provide the LE80537LG0254MS LAET from our CPU - Central Processing Units category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the LE80537LG0254MS LAET and other electronic components in the CPU - Central Processing Units category and beyond.

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Thermal Control Thermal Control Product Brief Intel Core2 Duo Processors Embedded Computing Intel Core 2 Duo Processors T9400, T7500, T7400, L7500, L7400 and U7500 for Embedded Computing I ntel Smart Memory Access accelerates out-of-order Product Overview execution, reduces time in-flight instructions must wait Intel Core2 Duo processors members of Intels growing for data, and moves data from system memory into fast product line of multi-core processors based on Intel Core micro- L2 cache prior to execution. architecture now feature 45nm process technology (T9400 ) to deliver more energy-efficient performance. Intel Core 2 Duo Intel Advanced Digital Media Boost accelerates execution of processor technology makes it possible to integrate two complete Streaming SIMD Extension (SSE) instructions to significantly execution cores in one physical package, providing advancements improve performance of video, audio, and image processing in simultaneous computing for multi-threaded applications and for multimedia, encryption, financial, engineering, and scientific multi-tasking environments. Intels new hafnium-based 45nm Hi-k applications. 128-bit SSE instructions, issued at a throughput silicon process technology enables even more processor perform- rate of one per clock cycle, effectively doubles speed of execu- ance by doubling transistor density and increasing cache size by tion over previous-generation processors. 45nm versions include up to 50 percent. The result is improved speed and efficiency, new Super Shuffle Engine to improve existing SSE instructions relative to previous-generation dual-core Intel processors. while enabling significant gains on the latest SSE4 instruction set. This provides additional performance improvements in Intel Core 2 Duo processors meet the needs of a wide range of SSE4-optimized applications, such as video editing and performance-intensive, low-power embedded applications in encoding in high-definition resolution. smaller form factors such as interactive clients (i.e., point-of-sale terminals and ATMs), gaming platforms, industrial control and automation, digital security surveillance and medical imaging. Arch State Arch State While incorporating advanced processor technology, they Execution Execution remain software-compatible with previous IA-32 processors. Resources Resources Intel Core Microarchitecture L1 Caches L1 Caches APIC APIC Energy-efficient performance helps equipment manufacturers Shared L2 Cache optimally balance processing capabilities within power and Power Mgmt Core space constraints. Coordination Logic Coordination Logic Bus Interface I ntel Wide Dynamic Execution allows each core to simultaneously complete up to four full instructions per clock cycle. I ntel Advanced Smart Cache significantly reduces memory Intel Core2 Duo processor, based on Intel Core microarchitecture, includes two complete execution cores, shared L2 cache, and latency to frequently used data through dynamic allocation intelligent power management features which deliver significantly of shared L2 cache. greater performance-per-watt over previous-generation dual-core Intel processors.Intel Core Microarchitecture (continued) 1 3 I ntel Virtualization Technology allows one hardware platform E xecute Disable Bit marks memory regions as executable or non- to function as multiple virtual platforms, improving manage- executable when combined with a supporting operating system. ability, limiting downtime and maintaining worker productivity. D igital Thermal Sensor (DTS) enables efficient processor and Provides greater isolation and security between different platform thermal control. Thermal sensors located within the applications and operating systems for added protection. processor measure maximum temperature on the die at any 2 I ntel 64 Architecture supports 64-bit instructions, given time. providing flexibility for 64-bit and 32-bit applications Embedded lifecycle support protects system investment by and operating systems. enabling extended product availability for embedded customers. I ntel Trusted Execution Technology (Intel TXT) defends Intel Embedded and Communications Alliance (intel.com/go/eca) against software-based attacks and helps protect confiden- helps developers cost-effectively meet design challenges and tiality and integrity of data stored or created on the system. shorten time-to-market through collaboration with a strong Enables each application to run within its own space, protected ecosystem of hardware and software vendors. from all other software on the system. Intel Core2 Duo Processor Platform Features Intel Core2 Duo Processor T9400 Based on Intel 45nm technology Validated with Mobile Intel GM45 Express chipset Excellent processor and graphics performance, storage speed and reliability Up to 8 GB 667/800 MHz DDR2 or 800/1067 MHz DDR3 SODIMM system memory Graphics core performance up to 533 MHz Validated with power-optimized Intel 5100 Memory Controller Hub chipset with Intel 82801IR I/O Controller Hub 9R 30 lanes of PCI Express* for I/O connectivity Supports dual-channel DDR2 registered ECC memory (533 MHz and 667 MHz) to help safeguard data and improve reliability Performance-per-watt advantage for single-processor bladed form factor applications Intel Core2 Duo Processors B ased on Intel 65nm process technology T7500 /L7500 /U7500 Validated with Mobile Intel GME965 Express chipset Excellent storage speed, reliability and remote asset management capabilities Integrated 32-bit 3D graphics engine, and up to 4 GB of 533/667 MHz DDR2 SODIMM system memory Graphics core performance up to 500 MHz L7500 offers low-power, value-sensitive solution U7500 provides ultra low-power solution with excellent graphics performance Intel Core2 Duo Processors Based on Intel 65nm process technology T7400 /L7400 /U7500 Validated with Mobile Intel 945GME Express chipset Superb graphics, I/O bandwidth, storage speed, reliability and remote asset management capabilities Integrated 32-bit 3D graphics engine Up to 4 GB of 400/533/667 MHz DDR2 SODIMM system memory T7400 and L7400 also validated with Intel E7520 chipset, addressing the needs of high-performance, low-power platforms within small form factor designs L7400 and U7500 also validated with Intel 3100 chipset, an integrated chipset offering low-power platform solutions for thermally sensitive and performance-intensive embedded, communications and storage applications

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8542.31.00 52 No ..CMOS and MOS Microprocessors (MPU), Microcontrollers (MCU) and Digital Signal Processors (DSP)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits Digital.
Altera (part of the Intel Group)
Altera (VA)
Altera Corporation
INTEL (ALTERA)
Intel (CPU)
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INTEL / LEVEL ONE
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