COMPONENTS PRODUCT INFORMATION CONNECTOR 0.4mm pitch Board to Board connector NEW MB-0136-2 WA6 Series July 2006 RoHSCompliant < Outline > The WA6 Series are 0.4mm pitch high density, compact connectors adapted to SMT, for board to board (parallel board) connection with connector warpage prevention feature, industry leading high pin counts, 214 position has been developed. Low profile connector with 3 mm stacking height saves mounting space as much as possible. WA6 has been employed as JEDEC standard for compact notebook PC memory modules(214 pos., DDR2, Micro-DIMM). Best suits for high density mounting and multi-pole interconnection of TVs and PCs interior mounting. Features Parallel board stacking height 3mm type low-profile design, No. of contacts: 214 pos. Coplanarity of terminal portion held under 0.1mm. Contacts for solder reinforcement are provided in each corner of the connector. (2 contacts x 4 corners, total 8 contacts) Contact wiping length is 0.6mm. Prevents solder wicking by integrated molding technology of contact and resin mold.(Plug) Compatible to automatic mounting Both plug and receptacle have enough absorption surface for automatic mounting. Products with kapton tape are available. Available in embossed tape (width of tape plug side: 56mm, receptacle side: 72mm) Also available with and without a positioning boss, that secures correct positioning when mounting. No polar characteristics are applied to this connector. General Specifications Rated current: AC, DC each 0.3A/ per pin No. of contacts :214 pos. Rated voltage: AC200CV Contact resistance: 70m ohm max. Insulation resistance: 100M ohm min. Dielectric withstanding voltage : Contact pitch: 0.4mm AC500Vr. m.s per minute Operating temperature: -55 Deg C to +85 Deg. C 1/5 JAE PMK Div. Proprietary. Copyright 2006Japan Aviation Electronics Industry, Ltd.MB-0136-2 Materials and Finishes WA6F214VA1T (Receptacle side) Components Materials /Finishes Contact Copper alloy/ Contact area: Au Terminal area: Au flash Reinforced soldering Copper alloy/ contacts Terminal area: Au flash Insulator Heat resistant plastic/ none Heat resistant tape Polyimide/ none WA6M214VA1T (Plug side) Components Materials /Finishes Contact Copper alloy/ Contact area: Au Terminal portion: Au flash Reinforced soldering Copper alloy/ contacts Terminal area: Au flash Insulator Heat resistant plastic/ none Heat resistant tape Polyimide/ none Cautions for Handling Please refer to Handling Instructions (JAHL-10196) when using the connector. The insertion force will be 9kg (214 pos.) When mating, in order to prevent problems from adding excessive stress to the connector, please reinforce the back side of the receptacle. No polar characteristics are applied to this connector. It is advised to take mechanical countermeasures as bolting to prevent connector coming off during drop test etc. Please refer to JEDEC specification MO-260B, SO-004A, when using as a memory module connection. 2/5 JAE PMK Div. Proprietary. Copyright 2006Japan Aviation Electronics Industry, Ltd.