Lackwerke Peters GmbH + Co KG Hooghe Weg 13, 47906 Kempen Internet: www.peters.de E-Mail: peters peters.de Telefon (0 21 52) 20 09-0 Telefax (0 21 52) 20 09-70 Ein Unternehmen der PETERS-Gruppe SURVEY Group 2 1 REPORT S2 2 Circuit printing lacquers 3 4 5 6 7 8 This survey report gives a comprehensive overview of product group 2. For further in- formation please refer to the technical reports (TR) and application information sheets (AI), in which the mentioned products are described in detail. 9 For more extensive advice, our application technology department (ATD) is at your dis- posal at any time. 10 The first column of this survey corresponds to the order in which our technical reports (TR) are filed in the report manual and/or supplements and new technical reports are to be added. Thus this survey also serves as a table of contents of 11 product group 2. = registered trademark of Lackwerke Peters GmbH + Co KG for photo- imageable lacquers 12 = registered trademark of Underwriters Laboratories Inc. Northbrook, Illinois 60062. 13 Table of contents 1. Application information sheets ............ 2 7. Marking inks........................................ 9 2. Etch and plating resists....................... 2 8. Thick film fillers ................................. 10 3. 1- and 2-pack ELPELECT dielectrics 4 9. Heatsink paste .................................. 11 14 4. Via hole fillers...................................... 4 10. Plugging pastes ................................ 11 5. 1-pack solder resists ........................... 5 11. Carbon-conductive inks .................... 12 6. Conventional and photoimageable 2- 12. Peelable solder masks...................... 12 pack solder resists .............................. 5 15 LP 031007 E-3/ 0200000e.003Survey report group 2 1. Application information sheets Application Information sheets (AI) apply to various lacquers/lacquer series and supplement the Technical Reports on these lacquers by giving detailed explanations of possible application proce- dures and individual process steps plus offering numerous practical tips and advice to safeguard the optimum processing of our products. The associated Technical Reports provide - in a concise and clear manner - numerous character- istics and processing data in transparent diagrams, graphics and tables. Currently the following application information sheet for group 2 is available: AI 2/1 Processing information for the photoimageable solder resists of the series ELPEMER 2467, ELPEMER 2469 and ELPEMER 2463 FLEX. 2. Etch and plating resists 2.1 General characteristics high definition enables the representation of fine conductors UV and thermal curing excellent adhesion and high surface hardness the flake strippable etch and plating resists (index FS) offer the advantage that the flakes can be removed from the stripper medium by means of filters so that the waste water contamination is reduced and the service life of the stripping solution increased. 2.2 Special characteristics of the liquid ELPEMER photoresists owing to their outstanding resolution, even ultra-fine conductors < 50 m can be represented with the photoimageable resists of the series ELPEMER particularly suited for the production of multilayer inner layers. 2.3 Product-specific characteristics Product (series) Special properties Etch and plating resist application by screen printing SD 2050 UV, blue UV curing (index UV) suited for 150 m technology can be used to etch 400 m copper resistant up to pH 9 very easily stripped in alkaline media Etch and plating resist application by screen printing SD 2051 UV-AL-FS, blue UV curing (index UV) suited for 150 m technology resistant to acid etching and plating baths very easily stripped in alkaline media (index AL) index FS = flake strippable Etch resists of the series application by screen printing SD 2052 AL air and oven drying SD 2042 AL, black resistant up to pH 9.5 SD 2052 AL, blue easily stripped in alkaline media (index AL) 2 www.peters.de