Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 200 VDC
(Commercial & Automotive Grade)
Overview
KEMETs Ceramic Open Mode capacitor in X7R dielectric is mechanical damage that may propagate during extreme envi-
designed to significantly minimize the probability of a low IR or ronmental and handling conditions, it does provide superior flex
short circuit condition when forced to failure in a board stress performance over standard termination systems. When combined
flex situation, thus reducing the potential for catastrophic failure. with flexible termination technology these devices offer the ultimate
The Open Mode capacitor may experience a drop in capaci- level of protection against a low IR or short circuit condition. Open
tance; however, a short is unlikely because a crack will not Mode devices compliment KEMET's Floating Electrode (FE-
typically propagate across counter electrodes within the devices CAP) and Floating Electrode with Flexible Termination (FF-CAP)
active area. Since there will not be any current leakage associ- product lines by providing a fail-safe design optimized for mid to
ated with a typical Open Mode flex crack, there is no localized high range capacitance values. These devices exhibit a predict-
heating and therefore little chance for a catastrophic and poten- able change in capacitance with respect to time and voltage and
tially costly failure event. boast a minimal change in capacitance with reference to ambient
temperature. Capacitance change is limited to 15% from -55C
Driven by the demand for a more robust and reliable com- to +125C.
ponent, the Open Mode capacitor was designed for critical
applications where higher operating temperatures and mechani-
cal stress are a concern. These capacitors are widely used in
automotive circuits as well as power supplies (input and output
filters) and general electronic applications.
Concerned with flex cracks resulting from excessive tensile
and shear stresses produced during board flexure and thermal
cycling? These devices are available with KEMET's Flexible
termination technology which inhibits the transfer of board
stress to the rigid ceramic body, therefore mitigating flex cracks
which can result in low IR or short circuit failures. Although flex -
ible termination technology does not eliminate the potential for
Ordering Information
C 1210 J 685 K 3 R A C TU
Case Size Specification/ Capacitance Capacitance Failure Rate/ Packaging/Grade
1
Ceramic Voltage Dielectric Termination Finish
2
( x ) Series Code (pF) Tolerance Design (C-Spec)
0805 F = Open Mode 2 Significant Digits K = 10% 4 = 16 V R = X7R A = N/A C = 100% Matte Sn Blank = Bulk
1206 J = Open Mode + Number of Zeros M = 20% 3 = 25 V L = SnPb (5% TU = 7" Reel
1210 with Flexible 5 = 50 V minimum) Unmarked
1812 Termination 1 = 100 V TM = 7" Reel Marked
2 = 200 V AUTO = Automotive
Grade
1
Additional termination finish options may be available. Contact KEMET for details.
1, 2
SnPb termination finish option is not available on automotive grade product.
2
Additional reeling or packaging options may be available. Contact KEMET for details.
One world. One KEMET
KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 (864) 963-6300 www.kemet.com C1012_X7R_OPENMODE_SMD 4/30/2014 1Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 200 VDC (Commercial & Automotive Grade)
Dimensions Millimeters (Inches) Standard Termination
L
W
T B
S
EIA Metric S
L W T B Mounting
Size Size Separation
Length Width Thickness Bandwidth Technique
Code Code Minimum
0805 2012 2.00 (.079) 0.20 (.008) 1.25 (.049) 0.20 (.008) 0.50 (0.02) 0.25 (.010) 0.75 (.030)
Solder Wave or
Solder Reflow
1206 3216 3.20 (.126) 0.20 (.008) 1.60 (.063) 0.20 (.008) 0.50 (0.02) 0.25 (.010)
See Table 2 for
Thickness
1210 3225 3.20 (.126) 0.20 (.008) 2.50 (.098) 0.20 (.008) 0.50 (0.02) 0.25 (.010) N/A
Solder Reflow Only
1812 4532 4.50 (.177) 0.30 (.012) 3.20 (.126) 0.30 (.012) 0.60 (.024) 0.35 (.014)
Dimensions Millimeters (Inches) Flexible Termination
EIA Metric S
L W T B Mounting
Size Size Separation
Length Width Thickness Bandwidth Technique
Code Code Minimum
0805 2012 2.00 (.079) 0.20 (.008) 1.25 (.049) 0.20 (.008) 0.50 (0.02) 0.25 (.010) 0.75 (.030)
Solder Wave or
Solder Reflow
1206 3216 3.30 (.130) 0.40 (.016) 1.60 (.063) 0.20 (.008) 0.60 (.024) 0.25 (.010)
See Table 2 for
Thickness
1210 3225 3.30 (.130) 0.40 (.016) 2.50 (.098) 0.20 (.008) 0.60 (.024) 0.25 (.010) N/A
Solder Reflow Only
1812 4532 4.50 (.178) 0.40 (.016) 3.20 (.126) 0.30 (.012) 0.70 (.028) 0.35 (.014)
Benefits
-55C to +125C operating temperature range Non-polar device, minimizing installation concerns
Open Mode/fail open design 100% pure matte tin-plated termination finish allowing for
Mid to high capacitance flex mitigation excellent solderability
Lead (Pb)-Free, RoHS and REACH compliant Commercial and Automotive (AECQ200) grades available
EIA 0805, 1206, 1210, and 1812 case sizes SnPb termination finish option available upon request (5%
DC voltage ratings of 16 V, 25 V, 50 V, 100 V, and 200 V minimum)
Capacitance offerings ranging from 1,000 pF to 6.8 F Flexible termination option available upon request
Available capacitance tolerances of 5%, 10%, and 20%
KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 (864) 963-6300 www.kemet.com C1012_X7R_OPENMODE_SMD 4/30/2014 2