Product Bulletin Surface Mount Ceramic Chip Capacitors High Temperature 200C C0G MLCC Bene ts and Features: No Piezoelectric Noise. Extremely low ESR and ESL. High Thermal Stability. High Ripple Current Capability. Preferred capacitance solution at line frequencies and into the MHz range. No capacitance change with respect to applied rated DC voltage. Minimal capacitance change with respect to temperature from -55C to +200C. No capacitance decay with time. Non-polar device. Applications: Typical applications include critical timing, tuning, circuits requiring low loss, circuits with pulse, high current, decoupling, by-pass, ltering, transient voltage suppression, blocking and energy storage for use in extreme environments com- monly present in applications such as down-hole exploration, aerospace engine compartments and geophysical probes KEMETs New High Temperature Surface Mount C0G MLCCs feature a robust and proprietary base metal dielectric system that offers industry-leading performance relative to capacitance and case size combined with capacitance stability at extreme temperatures up to +200C. This new platform promotes downsizing opportu- nities of existing High Temperature C0G technology, and offers replacement opportunities of existing X7R/BX/ BR technologies. Standard capacitance ratings for these devices range from 0.5 pF up to 0.22 F in capacitance tolerance offer- ings of 0.25pF, 0.5pF, 1%, 2%, 5%, 10%, or 20%. The Temperature Coef cient of Capacitance (TCC) is 30ppm/C from -55C to +200. Devices are available in DC voltage ratings of 10V, 16V, 25V, 50V and 100V, with a maximum dissipation factor of 0.10%. Seven standard EIA case size options are available which include 0603, 0805, 1206, 1210, and 1812- with either nickel barrier/tin or Sn/Pb terminations. Outline Drawing Dimensions - Millimeters (Inches) S EIA SIZE METRIC L W B SEPARATION CODE SIZE CODE LENGTH WIDTH BANDWIDTH minimum 0603 1608 1.6 (.063) .15 (.006) 0.8 (.032) .15 (.006) 0.35 (.014) .15 (.006) 0.7 (.028) 0805 2012 2.0 (.079) .20 (.008) 1.25 (.049) .20 (.008) 0.50 (.020) .25 (.010) 0.75 (.030) 1206 3216 3.2 (.126) .20 (.008) 1.6 (.063) .20 (.008) 0.50 (.020) .25 (.010) N/A 1210 3225 3.2 (.126) .20 (.008) 2.5 (.098) .20 (.008) 0.50 (.020) .25 (.010) N/A 1812 4532 4.5 (.177) .30 (.012) 3.2 (.126) .30 (.012) 0.60 (.024) .35 (.014) N/A KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 (864) 963-6300 www.kemet.com F4002 01/10Ordering Information C1210 H 124 J 5G A C TU Case Size Speci cation/ Capacitance Code Capacitance Failure Rate/ End Metallization Packaging/Grade Ceramic Voltage Dielectric (Lx W) Series (pF) Tolerance Design (Plated) (C-Spec)* 0603 H = High Temp (200C) 2 Sig. Digits + C = 0.25pF 8 = 10V G = C0G A = N/A C = 100% Matte Sn Blank = Bulk 0805 Number of D = 0.5pF 4 = 16V L = SnPb (5% min) TU = 7 Reel Unmarked 1206 Zeros* F = 1% 3 = 25V TM = 7 Reel Marked 1210 *Use 9 for 1.0 - 9.9pF G = 2% 6 = 35V 1812 *Use 8 for 0.5 - .99pF J = 5% 5 = 50V ex. 2.2pF = 229 K = 10% 1 = 100V ex. 0.5pF = 508 M = 20% 2 = 200V *Contact KEMET for availability and ordering details if you require additional reeling or packaging options. Additional termination options may be available, contact KEMET for details. Electrical Parameters/Characteristics Operating Temperature Range: -55C to +200C Temperature Coef cient of Capacitance : 30PPM/C (up to 200C) Aging Rate (Max % Cap Loss/Decade Hour): 0% Dielectric Withstanding Voltage: 250% Dissipation Factor (DF) 25C: .001 (0.10%) Max Insulation Resistance (IR) Limit 25C: 1000 megohm microfarads or 100G Insulation Resistance (IR) Limit 200C: 10 megohm microfarads or 1G Capacitance and Dissipation Factor (DF) measured under the following conditions: 1kHz and 1 Vrms if capacitance >1000pF 1MHz and 1 Vrms if capacitance 1000pF Quali cation/Certi cation RoHS-PRC (6/6) - 100% matte Sn termination Product Quali cation Test Plan RELIABILITY/ ENVIRONMENTAL TESTS per MIL-STD-202/JESD22 High Temperature Life 200C, Rated Voltage, 2000 Hours. Load Humidity 85C /85%RH, Rated Voltage, 1000 Hours. Low Voltage Humidity 85C /85%RH, 1.5V, 1000 Hours. Temperature Cycling -55C to +200C, 50 Cycles. Thermal Shock -55C to +150C, 20s transfer, 15 min dwell, 300 Cycles. Moisture Resistance Cycled Temp / RH. 0V, 10 cycles 24 Hrs each. PHYSICAL, MECHANICAL & PROCESS TESTS per MIL-STD 202/JIS-C-6429 Resistance to Solvents Include Aqueous wash chemical - OKEM Clean or equivalent. Mechanical Shock and Vibration Method 213: Figure 1, Condition F Method 204: 5 gs for 20 min,12 cycles. Restistance to Soldering Heat Condition B, no pre-heat of samples, Single Wave Solder. Terminal Strength Force of 1.8 kg for 60 seconds. Board Flex 3mm minimum. KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 (864) 963-6300 www.kemet.com F4002 01/10