Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, C0G Dielectric, 10 200 VDC (Commercial & Automotive Grade) Overview KEMETs Ceramic Chip Capacitor Array in C0G dielectric is KEMETs C0G dielectric features a 125C maximum an advanced passive technology, where multiple capacitor operating temperature and is considered stable The elements are integrated into one common monolithic Electronics Industries Alliance (EIA) characterizes C0G structure. Array technology promotes reduced placement dielectric as a Class I material. Components of this costs and increased throughput. This is achieved by classification are temperature compensating and are suited alternatively placing one device rather than two or four for resonant circuit applications or those where Q and discrete devices. Use of capacitor arrays also saves board stability of capacitance characteristics are required. C0G space, which translates into increased board density and exhibits no change in capacitance with respect to time and more functions per board. Arrays consume only a portion voltage and boasts a negligible change in capacitance with of the space required for standard chips, resulting in reference to ambient temperature. Capacitance change is savings in inventory and pick/place machine positions. limited to 30 ppm/C from 55C to +125C. For added reliability, KEMET s Flexible Termination KEMET automotive grade array capacitors meet the technology has been incorporated in order to provide demanding Automotive Electronics Council s AEC-Q200 superior flex performance. This technology was developed qualification requirements. to address flex cracks, which are the primary failure mode of MLCCs and typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling. Flexible Termination technology inhibits the transfer of board stress to the rigid body of the MLCC, therefore mitigating flex cracks which can result in low IR or short circuit failures. Ordering Information CA 06 4 X 104 K 4 G A C TU Rated Failure Ceramic Case Size Number of Specification/ Capacitance Capacitance Packaging/ 2 Voltage Dielectric Rate/ Termination Finish 1 Array ( x ) Capacitors Series Code (pF) Tolerance Grade (C-Spec) (VDC) Design 06 = 0612 4 = 4 X = Flexible Two J = 5% 8 = 10 G = C0G A = N/A C = 100% Matte Sn See Termination significant K = 10% 4 = 16 L = SnPb Packaging digits and M = 20% 3 = 25 (5% minimum Pb C-Spec number of 5 = 50 content) Ordering zeros 1 = 100 Options Tabl 2 = 200 1 All previous reference to metric case dimension1632 has been replaced with an inch standard reference of0612 . Please reference all new designs using the0612 nomenclature.CA064 replacesC1632 in the ordering code. 2 Additional termination finish options may be available. Contact KEMET for details. 2 SnPb termination finish option is not available on automotive grade product. Built Into Tomorrow KEMET Electronics Corporation KEMET Tower One East Broward Boulevard C1016 C0G ARRAY SMD 8/11/2020 1 Fort Lauderdale, FL 33301 USA 954-766-2800 www.kemet.comSurface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, C0G Dielectric, 10 200 VDC, (Commercial & Automotive Grade) Packaging C-Spec Ordering Options Table Packaging/Grade Packaging Type Ordering Code (C-Spec) 1 Commercial Grade Bulk Bag Not Required (Blank) 7 Reel/Unmarked TU 13 Reel/Unmarked 7210 2 Automotive Grade 7 Reel AUTO 13 Reel/Unmarked AUTO7210 1 Default packaging isBulk Ba. An ordering code C-Spec is not required forBulk Ba packaging. 1 The termsMarke andUnmarke pertain to laser marking option of capacitors. All packaging options labeled asUnmarke will contain capacitors that have not been laser marked. The option to laser mark is not available on these devices. For more information seeCapacitor Markin. 2 Reeling tape options (Paper or Plastic) are dependent on capacitor case size ( x ) and thickness dimension. SeeChip Thickness/Tape & Reel Packaging Quantitie andTape & Reel Packaging Informatio. 2 For additional Information regardingAUT C-Spec options, seeAutomotive C-Spec Informatio. 2 All Automotive packaging C-Specs listed exclude the option to laser mark components. The option to laser mark is not available on these devices. For more information seeCapacitor Markin. Benefits 55C to +125C operating temperature range Capacitance offerings ranging from 10 to 470 pF Superior flex performance (up to 5 mm) Available capacitance tolerances of 5%, 10%, and 20% Saves both circuit board and inventory space Non-polar device, minimizing installation concerns Reduces placement costs and increases throughput 100% pure matte tin-plated termination finish allowing for Lead (Pb)-free, RoHS and REACH compliant excellent solderability 0612 (4-element) case size SnPb termination finish option available upon request DC voltage ratings of 10 V, 16 V, 25 V, 50 V, 100 V, (5% Pb minimum) and 200 V Commercial and Automotive (AEC-Q200) grades available Applications Typical applications include those that can benefit from board area savings, cost savings, and overall volumetric reduction such as telecommunications, computers, handheld devices and automotive. Flexible termination technology benefits applications subject to high levels of board flexure or temperature cycling. KEMET Electronics Corporation KEMET Tower One East Broward Boulevard C1016 C0G ARRAY SMD 8/11/20220 2 Fort Lauderdale, FL 33301 USA 954-766-2800 www.kemet.com