Surface Mount Polyethylene Naphthalate (PEN) Film Capacitor LDE, Unencapsulated Stacked Chip, Size 1206 6054, 50 1,000 VDC (Automotive Grade) Overview Applications Polyethylene naphthalate (PEN) film capacitor for sur face Typical applications include filtering, timing, bypassing, and mounting, which meets the demanding Automotive coupling. LDE is a general purpose series designed for the Electronics Council s AECQ200 qualification requirements. highest reliability and high temperature service. Not suitable for across-the-line application (see suppressor capacitors). Benefits Rated voltage: 50 1,000 VDC Rated voltage: 40 250 VAC Capacitance range: 0.001 4.7 F EIA Size: 1206 6054 Capacitance tolerance: 10%, 20%, 5% on request Climatic category: 55/125/56 RoHS Compliant and lead-free terminations O p e r a ti n g te m p e r a t u r e r a n g e of 5 5 C to +125 C Automotive (AECQ200) grades available Part Number System LDE C C 2560 M A 5 N 00 Rated Voltage Capacitance Capacitance Series Size Code Dielectric Version Packaging Internal Use (VDC) Code (pF) Tolerance Metallized C = 50 See Digits two K = 10% A = PEN 5 = Standard See Ordering 00 (Standard) PEN D = 63 Dimension four indicate M = 20% 0 = Miniature Options Table E = 100 Table t h e fi r s t t h r e e J = 5% on I = 250 digits of the request M = 400 capacitance P = 630 value. Q = 1,000 First digit indicates the number of zeros to be added. Built Into Tomorrow KEMET Electronics Corporation KEMET Tower One East Broward Boulevard F3078 LDE 9/13/2021 1 Fort Lauderdale, FL 33301 USA 954-766-2800 www.kemet.comSurface Mount Polyethylene Naphthalate (PEN) Film Capacitor LDE, Unencapsulated Stacked Chip, Size 1206 6054, 50 1,000 VDC (Automotive Grade) Dimensions Millimeters T L B Chip Size H Size Code (EIA) (Maximum) Nominal Tolerance Nominal Tolerance Nominal Tolerance A 1206 1.7 0.2 3.3 + 0. 3 / 0.1 0.4 + 0.5 / 0. 3 B 1210 2.5 0.3 3.3 + 0. 3 / 0.1 0.4 + 0.5 / 0. 3 C 1812 3.3 0.3 4.7 + 0. 3 / 0. 2 0.4 + 0.5 / 0. 3 See D 2220 5.0 0.4 6.0 0.3 0.4 + 0.5 / 0. 3 Part Number E 2824 6.1 0.4 7.3 0.4 0.4 + 0.5 / 0. 3 Table F 4030 7.9 0.5 10.5 0.4 0.4 + 0.5 / 0. 3 G 5040 10.4 0.5 13.0 0.4 0.4 + 0.5 / 0. 3 H 6054 13.7 0.5 15.5 + 0.4 / 0.9 0.4 + 0.5 / 0. 3 Landing Areas and Solder Paste Suggestions A B C D Dimensions in mm Dimensions in mm Size Size A B C D A B C D 1206 1.5 1.1 2.3 4.5 2824 5.7 2.3 5.3 9.9 1210 2.3 1.1 2.3 4.5 4030 7.4 2.6 8.2 13.4 1812 3.0 1.7 3.1 6.5 5040 9.6 2.6 10.7 15.9 2220 4.6 2.1 3.9 8.1 6054 12.6 2.6 13.2 18.4 These landing area dimensions have the aim of taking full advantage of the new RoHS 6 terminations design. We suggest to use a Sn/Ag/Cu solder paste (suggested thickness: 0.10 0.15 mm). If a NOT Lead Free solder paste is used, a minimum peak temperature of 210C on the components body is suggested. KEMET Electronics Corporation KEMET Tower One East Broward Boulevard F3078 LDE 9/13/2021 2 Fort Lauderdale, FL 33301 USA 954-766-2800 www.kemet.com