04-0595-0000 Kester

TECHNICAL DATA SHEET Ultrapure High-Reliability Extruded Solder Solder for Lead-bearing and Lead-free Alloys Product Description For soldering applications which require maximum reliability of solder joints, especially for surface mounted components, only solder of the highest purity is acceptable. Kester does not make any vague claims of outstanding solder purity. Complete analysis of Kester bar and wire solders prove that every batch conforms to the strictest quality control standards in the solder industry. Maximum Allowed Impurities Ultrapure meets the requirements of current industry standards for allowable impurity requirements. Kester Ultrapure Kester Ultrapure Element J-STD-006C (Lead-Free) (Leaded) Tin Component Balance 63.500 Lead 0.070 or Component 0.070 Balance Antimony 0.200 or Component 0.200 0.200 Copper 0.080 or Component 0.080 0.080 Gold 0.050 0.050 0.050 Aluminum 0.005 0.005 0.005 Cadmium 0.002 0.002 0.002 Zinc 0.003 0.003 0.003 Silver 0.100 or Component 0.100 0.100 Bismuth 0.100 0.100 0.100 Arsenic 0.030 0.030 0.030 Iron 0.020 0.020 0.020 Indium 0.100 0.100 0.100 Nickel 0.010 0.010 0.010 Ultrapure will conform to these requirements when purchased directly or through stocking distributors. Kester is the only manufacturer of Ultrapure quality solder. Ultrapure conforms to the requirements of J-STD-006C formerly QQ-S-571F. DOD-STD-2000-1A (Soldering Technology, High Quality/High Reliability) states that it is the responsibility of the manufacturer to select those materials and processes that will produce acceptable high quality/high reliability products. Except where otherwise indicated, the component elements in each alloy shall deviate Ultrapure High-Reliability Extruded Solder Technical Data Sheet Issue: 17 May 2021 Page 1 of 3 TECHNICAL DATA SHEET from their nominal mass percent- age by not > 0.10% of the alloy mass when their nominal percentage is 1.0% by not > 0.20% of the alloy mass when their nominal percentage is > 1.0% to 5.0% or by not > 0.50% when their nominal percentage is > 5.0%. Availability Alloy Ultrapure meets the requirements of current industry standards for allowable impurity requirements. Below is a list of typical leaded and lead-free alloys produced by Kester in bar and wire form. Other alloys can be produced and follow the same requirements. Leaded Alloys Meting Point Sn62Pb36Ag2 179 to 183 C (354 to 361 F) Sn63Pb37 183 C (361 F) Sn60Pb40 183 to 190 C (361 to 374 F) Sn10Pb88Ag2 268 to 299 C (514 to 570 F) Sn5Pb92.5Ag2.5 280 C (536 F) Lead-Free Alloys Meting Point Sn96.5Ag3.0Cu0.5 217 to 220 C (423 to 428 F) Sn96.5Ag3.5 221 C (430 F) Sn97Ag3 221 to 224 C (430 to 435 F) K100LD ~227 C (441 F) Sn99.3Cu0.7 227 C (441 F) Sn100 232 C (450 F) Sn95Sb5 232 to 240 C (450 to 464 F) Ultrapure High-Reliability Extruded Solder Technical Data Sheet Issue: 17 May 2021 Page 2 of 3