16-6040-0062 Kester

TECHNICAL DATA SHEET Leaded Solid Solder Wire for High Reliability Soldering Product Description For soldering applications that require maximum reliability of solder joints, especially for surface mounted components, through hole and final assembly, only solder of the highest purity is acceptable. Kester does not make any vague claims of understanding solder purity. Only the highest quality metals are used to make Kester Solder Wire. Complete analysis of Kester Solder Wire proves that every batch conforms to the strictest quality controls in the solder industry. Maximum Allowed Impurities Kester Solder Wire meets IPC Specifications J-STD-006C Amendment 1. Element Symbol ANSI/IPC J-STD-006C Antimony Sb 0.200 Copper Cu 0.080 Gold Au 0.050 Aluminum Al 0.005 Cadmium Cd 0.002 Zinc Zn 0.003 Silver Ag 0.100 Bismuth Bi 0.100 Arsenic As 0.030 Iron Fe 0.020 Nickel Ni 0.010 Indium In 0.100 The component elements in each alloy shall deviate from their nominal mass percentage by not more than 0.020% of the alloy mass when their nominal percentage is <0.10% by not more than 0.10% of the alloy mass when their nominal percentage is >0.10% to <1.0% by not more than 0.20% of the alloy mass when their nominal percentage is >1.0% to <5.0% or by not more than 0.50% when their nominal percentage is >5.0%. Leaded Solid Solder Wire Technical Data Sheet Issue: 18 May 2021 Page 1 of 3 TECHNICAL DATA SHEET Kester solder purchased directly or through stocking distributors will conform to these requirements. Only highest purity virgin metals are used to make Kester wire. DOD-STD-2000- 1A (Soldering Technology High Quality/High Reliability) states that it is the responsibility of the manufacturer to select those materials and processes that will produce acceptable high quality/high reliability products. RoHS Compliance Kester does not determine any applicable Restriction of Hazardous Substances (RoHS) exemptions for our lead containing products at the user level. Availability Alloy Melting Point Sn63Pb37 183 C (361 F) Sn60Pb40 183 to 190 C (361 to 374 F) Sn50Pb50 183 to 212 C (361 to 414 F) Sn40Pb60 183 to 238 C (361 to 460 F) Sn5Pb93.5Ag1.5 296 to 301 C (565 to 574 F) Sn5Pb95 301 to 314 C (574 to 597 F) Other alloy compositions may be available. Consult your local Kester Sales Representative. Leaded Solid Solder Wire Technical Data Sheet Issue: 18 May 2021 Page 2 of 3