331 331 Organic Cored Wire Organic Cored Wire For Lead-bearing and Lead-free alloys For Lead-bearing and Lead-free alloys Product Description Reliability Properties Copper Mirror Corrosion: High Kester 331 Organic Flux is a water soluble formula Tested to J-STD-004, IPC-TM-650, Method 2.3.32 for use in flux-cored solder wire. This cored solder version of the popular 2331-ZX Neutral Organic Corrosion Test: High Water Soluble Liquid Flux is more effective than Tested to J-STD-004, IPC-TM-650, Method 2.6.15 rosin fluxes in soldering difficult metals. The same fast action and mild properties are exhibited with Silver Chromate: Fail 331 Organic Flux as with the liquid 2331-ZX. The Tested to J-STD-004, IPC-TM-650, Method 2.3.33 flux is more heat stable than most organic fluxes, Chloride and Bromides: 1.2% resulting in minimal smoke and odor. The residue Tested to J-STD-004, IPC-TM-650, Method 2.3.35 can be completely removed with a simple water rinse. Fluorides by Spot Test: Pass Tested to J-STD-004, IPC-TM-650, Method 2.3.35.1 Performance Characteristics: Excellent solderability to a wide variety of SIR, IPC (typical): Pass Tested to J-STD-004, IPC-TM-650, Method 2.6.3.3 metallizations Easy residue removal in DI water Blank 331 Compatible with leaded and lead-free alloys 10 9 Day 1 1.9 10 2.0 10 Classified as ORH1 per J-STD-004 10 9 Day 4 2.2 10 7.8 10 10 9 Day 7 1.7 10 4.1 10 RoHS Compliance This product meets the requirements of the RoHS (Restriction of Hazardous Substances) Directive, 2002/95/EC Article 4 for the stated banned substances. (Applies only if this core flux is combined with a lead free alloy)331 Application Notes Availability: Kester 331 is available in a wide variety of alloys, wire diameters and flux percentages. For most applications, Sn63Pb37 or Sn96.5Ag3.0Cu0.5 is used. Consult the alloy temperature chart in Kesters product catalog for a comprehensive alloy list. The standard wire diameter for most applications is 1.00mm (0.031in). Wire diameters range from 0.25 - 6.00mm (0.010 to 0.250in). AStandard Wire Diameter chart is included in Kesters product catalog. The amount of flux in the wire dictates the ease of soldering for an application. For most applications, core 58 and 66 (2.2% and 3.3% flux by weight, respectively) are recommended. Core size 50 (1.1% flux by weight) is also available. Kester 331 is packaged on spools of different sizes to accom- modate a variety of applications. Process Considerations: Solder iron tip temperatures are most commonly between 315-371C (600-700F) for Sn63Pb37 and Sn62Pb36Ag02 alloys and 371-427C (700-800F) for lead-free alloys. Heat both the land area and component lead to be soldered with the iron prior to adding Kester 331 cored wire. Apply the solder wire to the land area or component lead. Do not apply the wire directly to the soldering iron tip. If needed, Kester 2331-ZX organic flux may be used as a compatible liquid flux to aid in reworking soldered joints. Kester 2331-ZX is also available in Flux-Pens for optimum board cleanliness. Cleaning: The 331 flux residue is conductive and may cause corrosion of metal parts over time. Soldered samples left up to 48 hours in a simulated production environment, without removing the flux, showed no evidence of the flux residue having any corrosive properties. Kester 331 Organic Flux has the advantage over many competitive water-soluble flux formulations in that the residue is easily and completely removed with plain water. No neutralizers. saponifiers or detergents are necessary to completely solubilize the residue. Softened tap water or deionized water is recommended for high reliability. Use of hard or high mineral content tap water will lower ionic cleanliness measurements. Storage, Handling, and Shelf Life: Storage must be in a dry, non-corrosive environment. The surface may lose its shine and appear a dull shade of grey. This is a surface phenomena and is not detrimental to product functionality. Flux cored solder wire has a limited shelf life determined by the alloy used in the wire. For alloys containing > 70% lead, the shelf life is two years from date of manufacture. Other alloys have a shelf life of three years from date of manufacture. Health & Safety: This product, during handling or use, may be hazardous to health or the environment. Read the Material Safety Data Sheet and warning label before using this product. World Headquarters: 515 E. Touhy Avenue, Des Plaines, Illinois, 60018 USA Phone: (+1) 847-297-1600 Email: customerservice kester.com Website: www.kester.com Asia Pacific Headquarters European Headquarters Japanese Headquarters 500 Chai Chee Lane Ganghoferstrasse 45 20-11 Yokokawa 2-Chome Singapore 469024 D-82216 Gernlinden Sumida-Ku (+65) 6449-1133 Germany Tokyo 130-0003 Japan customerservice kester.com.sg (+49) 8142-47850 (+81) 3-3624-5351 customerservice kester-eu.com jpsales kester.com.sg The data recommendations presented are based on tests, which we consider reliable. Because Kester has no control over the conditions of use, we disclaim any responsibility connected with the use of any of our products or the information presented. We advise that all chemical products be used only by or under the direction of technically qualified personnel who are aware of the poten- tial hazards involved and the necessity for reasonable care in their handling. The technical information contained herein is consistent with the properties of this material but should not be used in the preparation of specifications as it is intended for reference only. For assistance in preparing specifications, please contact your local Kester office for details. Rev: 12Jul06