Technical Data Sheet 275 Flux-Cored Wire No-Clean Cored Wire for Lead-free and Leaded Alloys Product Description Kester 275 Flux for cored solder wire was developed to provide superior wetting performance for hand soldering in the electronics industry. The chemistry is based on some of the same principles that have been safely used for years in mildly activated rosin fluxes. The use of 275 results in an extremely clear post-soldering residue without cleaning. The unique chemistry in 275 was also designed to reduce spattering common to most core fluxes. 275 can be used for both lead-free and leaded soldering. Performance Characteristics: Colorless translucent residues Eliminates the need and expense of Compatible with lead-free and Improves wetting performance cleaning leaded alloys Excellent solderability and fast Low smoke and odor Classified as ROL0 per J-STD-004 wetting to a variety of surface Low spattering Compliant to Bellcore GR-78 finishes RoHS Compliance This product meets the requirements of the Restriction of Hazardous Substances (RoHS) Directive, 2011/65/EU for the stated banned substances. (Applies only if this core flux is combined with a lead-free alloy) Reliability Properties Chloride and Bromides: None Surface Insulation Resistivity (SIR) Copper Mirror Corrosion: Low Tested to J-STD-004, IPC-TM-650, Method Detected 85C/85%RH, IPC (typical): Pass Tested to J-STD-004, IPC-TM-650, Method Tested to J-STD-004, IPC-TM-650, Method 2.3.32 2.6.3.3 2.3.35 Corrosion Test: Low Blank 275 Tested to J-STD-004, IPC-TM-650, Method Fluorides by Spot Test: Pass 10 10 2.6.15 Day 1 1.6*10 1.1*10 Tested to J-STD-004, IPC-TM-650, Method 2.3.35.1 10 9 Day 4 1.2*10 9.2*10 Silver Chromate: Pass Tested to J-STD-004, IPC-TM-650, Method 10 9 Day 7 1.1*10 8.6*10 Spread Test (typical): 2.3.33 Tested to J-STD-004, IPC-TM-650, Method 2.4.46 Surface Insulation Resistivity (SIR) 40C/90%RH, IPC (typical): Pass 2 2 Tested to J-STD-004B, IPC-TM-650, Method Area of Spread mm (in ) 2.6.3.7 Flux Cored Sn96.5Ag3.0Cu0.5 Sn63Pb37 Solder 285 Mildly Activated 213 (0.33) 335 (0.52) Rosin 245 No- 200 (0.31) 348 (0.54) Clean 275 No- 219 (0.34) 361 (0.56) Clean Global Headquarters: 800 West Thorndale Avenue, Itasca, IL USA 60143 Phone: +1 800.2.KESTER Fax: +1 630.616.4044 Asia-Pacific Headquarters: 61 Ubi Avenue 1 06-01 UB Point, Singapore 408941 Phone: +65 6.449.1133 Fax: +65 6.242.9036 European Headquarters: Ganghofer Strasse 45, 82216 Gernlinden, Germany Phone: +49 (0) 8142 4785 0 Fax: +49 (0) 8142 4785 61 Asia Manufacturing: Hengqiao Road, Wujiang Economic Development Zone Suzhou, Jiangsu Province, China 215200 Phone: +86 512.82060807 Fax: +86 512.8206 0808 Website: www.kester.com Application Notes Availability 275 is available in a wide variety of alloys, wire diameters and flux percentages. For most applications, Sn63Pb37, Sn96.5Ag3.0Cu0.5 or K100LD is used. Please refer to www.kester.com for wire diameters, flux percentages, alloys and roll sizes that are available. Note: Core Size 50, 58 and 66 = 1.1%, 2.2% and 3.3% flux core. Process Considerations Solder iron tip temperatures are most commonly between 315-343C (600-650F) for Sn63Pb37 and Sn62Pb36Ag02 alloys, and between 371-400C (700-750F) for lead-free alloys. Heat both the land area and component lead to be soldered with the iron prior to touching the land with the cored wire. Do not apply the wire directly to the soldering iron tip. If needed, Kester 959T or 958M no clean flux may be used as a compatible liquid flux to aid in reworking soldered joints. Kester 959T is available in Flux-Pen for optimum board cleanliness. Cleaning The 275 flux residues are non-corrosive, non-conductive and do not require removal in most applications. IPA will not clean the residues off the surface of the circuit board after the soldering process. A saponifier or cleaning agent specifically designed to clean a no-clean flux is required to clean the residues. Please contact Kester Technical Support for further information. Storage and Warranty Period Storage must be in a dry, non-corrosive environment between 10-40C (50-104F). The surface may lose its shine and appear a dull shade of grey. This is a surface phenomenon and is not detrimental to product functionality. Flux-cored solder wire has a limited warranty period determined by the alloy used in the wire. For alloys containing more than 70% lead, the warranty period is 2 years from the date of manufacture. Other alloys have a warranty period of 3 years from the date of manufacture. Health and Safety This product, during handling or use, may be hazardous to your health or the environment. Read the Safety Data Sheet (SDS) and warning label before using this product. Global Headquarters: 800 West Thorndale Avenue, Itasca, IL USA 60143 Phone: +1 800.2.KESTER Fax: +1 630.616.4044 Asia-Pacific Headquarters: 61 Ubi Avenue 1 06-01 UB Point, Singapore 408941 Phone: +65 6.449.1133 Fax: +65 6.242.9036 European Headquarters: Ganghofer Strasse 45, 82216 Gernlinden, Germany Phone: +49 (0) 8142 4785 0 Fax: +49 (0) 8142 4785 61 Asia Manufacturing: Hengqiao Road, Wujiang Economic Development Zone Suzhou, Jiangsu Province, China 215200 Phone: +86 512.82060807 Fax: +86 512.8206 0808 Website: www.kester.com