TECHNICAL DATA SHEET 275 Flux-Cored Wire No-Clean Cored Wire for Lead-free and Leaded Alloys Product Description Kester 275 Flux-Cored Wire is designed to provide superior wetting performance for hand soldering in the electronics industry. The chemistry is based on some of the same principles that have been safely used for years in mildly activated rosin fluxes. The use of 275 results in an extremely clear post-soldering residue without cleaning. The unique chemistry in 275 was also designed to reduce spattering common to most core fluxes. 275 can be used for both lead-free and leaded soldering. For a list of compatible products, visit Kester website or contact Kester Technical Support. Performance Characteristics: Colorless translucent residues Improves wetting performance Excellent solderability and fast wetting to a variety of surface finishes Eliminates the need and expense of cleaning Low smoke and odor Low spattering Compatible with lead-free and leaded alloys Classified as ROL0 per J-STD-004 Compliant to Bellcore GR-78 RoHS Compliance This product meets the requirements of the Restriction of Hazardous Substances (RoHS) Directive, 2011/65/EU for the stated banned substances. (Applies only if this core flux is combined with a lead-free alloy.) Reliability Properties Copper Mirror Corrosion: Low Tested to J-STD-004, IPC-TM-650, Method 2.3.32 Corrosion Test: Low Tested to J-STD-004, IPC-TM-650, Method 2.6.15 Silver Chromate: Pass Tested to J-STD-004, IPC-TM-650, Method 2.3.33 275 Flux-Cored Wire Technical Data Sheet Issue: 17 May 2021 Page 1 of 4 TECHNICAL DATA SHEET Chloride and Bromides: None Detected Tested to J-STD-004, IPC-TM-650, Method 2.3.35 Fluorides by Spot Test: Pass Tested to J-STD-004, IPC-TM-650, Method 2.3.35.1 Spread Test (typical): Tested to J-STD-004, IPC-TM-650, Method 2.4.46 Area of Spread 2 2 mm (in ) Flux-Cored Sn96.5Ag3.0Cu0.5 Sn63Pb37 Solder 285 Mildly 213 (0.33) 335 (0.52) Activated Rosin 245 No-Clean 200 (0.31) 348 (0.54) 275 No-Clean 219 (0.34) 361 (0.56) Surface Insulation Resistance (SIR), IPC (typical): Pass Tested to J-STD-004, IPC-TM-650, Method 2.6.3.3 Test Conditions: 85 C, 85% RH, 7 days, 100V Surface Insulation Resistance (SIR) 40 C/90% RH, IPC (typical): Pass Tested to J-STD-004B, IPC-TM-650, Method 2.6.3.7 Availability 275 is available in a wide variety of alloys, wire diameters and flux percentages. For most applications, Sn63Pb37, Sn96.5Ag3.0Cu0.5 or K100LD is used. Please refer to