83-1000-0186 Kester

TECHNICAL DATA SHEET 186 Flux-Pen Mildly Activated Rosin Flux-Pen for Leaded and Lead-free Alloys Product Description Kester 186 Flux-Pen is specifically designed for leaded and lead-free rework of conventional and surface mount circuit board assemblies. 186 Flux-Pen under MIL-F-14256, was QPL approved as Type RMA. Although the fluxing ability approaches that of Type RA flux, residues after soldering are non-corrosive and non-conductive. 186 Flux-Pen has been developed for use in critical applications where difficult assemblies are to be soldered, but process requirements stipulate use of Type RMA flux. 186 Flux-Pen possess high thermal stability for soldering multi- layer assemblies which require higher temperatures. Exposure to high preheat temperatures does not degrade solubility of the residue in normal cleaning solvents. There is no surface insulation resistance degradation caused by the flux residue. The use of a minimum of ionic activating agents and the inactive nature of the residue permits leaving the residue on circuit board assemblies for many applications. The flux residue is also moisture and fungus resistant. Performance Characteristics: High thermal stability Improves soldering performance Eliminates the need and expense of cleaning Classified as ROL0 per J-STD-004 & J-STD-004B RoHS Compliance This product meets the requirements of the Restriction of Hazardous Substances (RoHS) Directive. Additional RoHS information is located at TECHNICAL DATA SHEET Reliability Properties Copper Mirror Corrosion: Low IPC-TM-650, Method 2.3.32 Corrosion Test: Low IPC-TM-650, Method 2.6.15 Silver Chromate: Pass IPC-TM-650, Method 2.3.33 Chloride and Bromides: 0.02% IPC-TM-650, Method 2.3.35 Electrochemical Migration (ECM): Pass IPC-TM-650 Method 2.6.14.1 65 C, 85% RH, 100V, 21days Surface Insulation Resistivity (SIR): Pass IPC-TM-650, Method 2.6.3.7 Surface Insulation Resistivity (SIR): Pass IPC-TM-650, Method 2.6.3.3 Flux Application 186 Flux-Pen is applied to circuit boards via Flux-Pen for rework of printed wire assemblies. Process Considerations 186 Flux-Pen should only be applied to areas that will be fully heated by the soldering iron or other reflow tool. Care should be taken to avoid flooding the assembly. The surface tension has been adjusted to help the flux form a thin film on the board surface allowing rapid solvent evaporation. Cleaning 186 Flux-Pen flux residues are non-conductive, non-corrosive and do not require removal in most applications. 186 Flux-Pen Technical Data Sheet Issue: 22 February 2021 Page 2 of 3