32044 Kontakt Chemie

Technical data sheet Heat Sink Compound Reference : 32044 1. General description Compound to increase the thermal conductivity and the efficient heat dissipation at electronic components. 2. Features High thermal conductivity. Excellent moisture buffer. Low metallic impurity content. 3. Applications Printed circuit boards. Electronic components. Control assemblies. 4. Directions Apply to a clean, dry surface. Do not mix with other products. Do not use on energized equipment. A safety data sheet (MSDS) according to EC Regulation N 1907/2006 Art.31 and amendments is available for all CRC products. 5. Typical product data (without propellant) Appearance Paste. Color White. Odor Characteristic odor. Density 2.3 g/cm3 ( 20C). 6. Packaging SE 24x20 G Manufactured by : 1/1 CRC Industries Europe bvba Touwslagerstraat 1 9240 Zele Belgium Tl.: (32)(0) 52/45.60.11 Fax : (32)(0) 52/45.00.34 www.crcind.com Technical data sheet Heat Sink Compound Reference : 32044 All statements in this publication are based on service experience and/or laboratory testing. Because of the wide variety of equipment, conditions of use and the unpredictable human factors involved, we recommend that our products are tested on-the-job prior to use. All information is given in good faith but without warranty neither expressed nor implied. This Technical Data Sheet may already have been revised as a result of a change in legislation, availability of components or newly acquired experiences. The latest and only valid version of this Technical Data Sheet will be sent to you upon simple request or can be found on our website: www.crcind.com We recommend that you register on our website for this product, thus enabling you to automatically receive any future updates. KOC-HEAT SINK COMPOUND-20130920 Version Date Manufactured by : 2/1 CRC Industries Europe bvba Touwslagerstraat 1 9240 Zele Belgium Tl.: (32)(0) 52/45.60.11 Fax : (32)(0) 52/45.00.34 www.crcind.com