X-On Electronics has gained recognition as a prominent supplier of 430126-503 Thermoelectric Peltier Modules across the USA, India, Europe, Australia, and various other global locations. 430126-503 Thermoelectric Peltier Modules are a product manufactured by Laird Connectivity. We provide cost-effective solutions for Thermoelectric Peltier Modules, ensuring timely deliveries around the world.

430126-503 Laird Connectivity

430126-503 electronic component of Laird Connectivity
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Part No.430126-503
Manufacturer: Laird Connectivity
Category: Thermoelectric Peltier Modules
Description: Thermoelectric Modules CP08,63,06,L,RT,W4.5 12x25x3.4mm
Datasheet: 430126-503 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 39.963 ea
Line Total: USD 39.96 
Availability - 37
Ship by Fri. 06 Dec to Tue. 10 Dec
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
37
Ship by Fri. 06 Dec to Tue. 10 Dec
MOQ : 1
Multiples : 1
1 : USD 39.963
5 : USD 37.0408
10 : USD 37.0293
20 : USD 36.1053
40 : USD 35.0774
120 : USD 35.0658
280 : USD 33.4141
520 : USD 33.4141
1000 : USD 33.4141

   
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RoHS - XON
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We are delighted to provide the 430126-503 from our Thermoelectric Peltier Modules category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the 430126-503 and other electronic components in the Thermoelectric Peltier Modules category and beyond.

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Ceramic Plate Series CP08,63,06 Thermoelectric Modules Innovative Technology for a Connected World The Ceramic Plate (CP) Series of Thermoelectric Modules (TEMs) is considered the standard in the thermoelectric industry. This broad product line of high-performance and highly reliable TEMs is available in numerous heat pumping capacities, geometric shapes, and input power ranges. Assembled with Bismuth Telluride semiconductor material and thermally conductive Aluminum Oxide ceramics, the CP Series is designed for higher current and large heat-pumping applications. FEATURES APPLICATIONS Precise Temperature Control Medical Lasers Compact Geometric Sizes Lab Science Instrumentation Reliable Solid State Operation Clinical Diagnostic Systems No Sound or Vibration Photonics Laser Systems Environmentally Friendly Electronic Enclosure Cooling DC Operation Food & Beverage Cooling RoHS Compliant Chillers (Liquid Cooling) PERFORMANCE SPECIFICATIONS Hot Side Temperature (C) 25C 50C Qmax (Watts) 9.0 9.9 Delta Tmax (C) 67 75 Imax (Amps) 2.1 2.1 Vmax (Volts) 7.6 8.2 Module Resistance (Ohms) 3.13 3.53 SUFFIX THICKNESS FLATNESS & HOT COLD Lead (PRIOR TO TINNING) PARALLELISM FACE FACE Length L 0.134 0.010 0.0015 / 0.0015 Lapped Lapped 4.5 L1 0.134 0.001 0.001 / 0.001 Lapped Lapped 4.5 L2 0.134 0.0005 0.0005 / 0.0005 Lapped Lapped 4.5 ML 0.138 0.010 0.002 / 0.002 Metallized Lapped 4.5 LM 0.138 0.010 0.002 / 0.002 Lapped Metallized 4.5 MM 0.142 0.010 0.002 / 0.002 Metallized Metallized 4.5 SEALING OPTION SUFFIX SEALANT COLOR TEMP RANGE DESCRIPTION RT RTV White -60 to 204 C Non-corrosive, silicone adhesive sealant EP Epoxy Black -55 to 150 C Low density syntactic foam epoxy encapsulant global solutions: local support TM Americas: +1 888.246.9050 Europe: +46.31.420530 Asia: +86.755.2714.1166 clv.customerpos lairdtech.com www.lairdtech.comCeramic Plate Series CP08,63,06 Thermoelectric Modules Innovative Technology for a Connected World Performance Curves at Th = 25C THERMO ELECTRIC 10.0 8.0 2.1 14.0 3.0 1.7 9.0 2.5 1.3 12.0 1.9 6.0 8.0 0.9 1.2 10.0 0.6 0.4 7.0 4.0 6.0 8.0 5.0 2.0 6.0 4.0 4.0 0.0 3.0 80 70 60 50 40 30 20 10 0 2.0 2.0 Delta T (C) 1.0 0.0 80 70 60 50 40 30 20 10 0 0.0 80 70 60 50 40 30 20 10 0 Delta T (C) 0.967.027 24.560.69 26 AWG PVC 0.484.027 12.290.69 4.5 (114) IN LENGTH HEAT SHRINK TUBING (2 PLACES) COLD FACE THICKNESS (SEE OPTIONS) HOT FACE OPERATING TIPS Max Operating Temperature: 80C Reference assembly guidelines for recommended installation Do not exceed Imax or Vmax when Solder tinning also available on operating module metallized ceramics CP08,63,06 0309 Any information furnished by Laird Technologies and its agents is believed to be accurate and reliable. Responsibility for the use and application of Laird Technologies materials rests with the end user since Laird Technologies and its agents cannot be aware of all potential uses. Laird Technologies makes no warranties as to the fitness, merchantability, or suitability of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies terms and conditions of sale in effect from time to time, a copy of which will be furnished upon request. For further information please visit our website at www.lairdtech.com Alternatively contact: sales lairdtech.com. Bluetooth is a trademark owned by Bluetooth SIG, Inc., USA and licensed to Laird Technologies. 2008 All Rights Reserved. Laird Technologies is a registered trademark of Laird Technologies, Inc. Qc (W) Voltage (V)

Tariff Desc

8542.31.20 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products
Laird / LS Research
Laird Connectivity
Laird Technologies EMI
Laird Technologies IAS
Laird Technologies Wireless M2M
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