430134-516 Laird Connectivity

ThermaTEC Series HT9-3-F2-2525 Thermoelectric Modules Note: This product has reached end of production and is available on a limited basis only. This product series has been replaced with the improved HiTemp ET Series product offering. Consider using ET9-3-F2-2525 HiTemp ET Series module as a replacement. The ThermaTEC Series of thermoelectric modules (TEMs) are designed to operate under cycling conditions or high temperature applications. This product line is available in multiple configurations and is ideal for applications that require both heating and cooling mode (reverse polarity) or power generation. Assembled with proprietary solder construction, Bismuth Telluride semiconductor material and thermally conductive Aluminum Oxide ceramics, the ThermaTEC Series is designed for higher current and larger heat- Americas: +1.919.597.7300 pumping applications. Europe: +46.31.420530 Asia: +86.755.2714.1166 FEATURES APPLICATIONS ets.sales lairdtech.com Thermal cycling durability Analytical instrumentation www.lairdtech.com Power cycling reliability PCR cyclers Precise temperature control Thermal test sockets Strong lead attachment Electronic enclosure cooling Chillers (liquid cooling) RoHS compliant Power generation Continuous operation at high temperatures SPECIFICATIONS TECHNICAL Hot Side Temperature (C) 25C 50C Qmax (Watts) 20.1 22.1 Delta Tmax (C) 63 75 Imax (Amps) 9.6 9.6 Vmax (Volts) 3.6 4.0 Module Resistance (Ohms) 0.34 0.38 SUFFIX THICKNESS FLATNESS & HOT FACE COLD FACE LEAD LENGTH (PRIOR TO PARALLELISM TINNING) 11 0.1970.005 0.002 /0.0035 Lapped Lapped 6.0 TA 0.1970.001 0.001/0.001 Lapped Lapped 6.0 TB 0.1970.0005 0.0005/0.0005 Lapped Lapped 6.0 SEALING OPTIONS SUFFIX SEALANT COLOR TEMP RANGE DESCRIPTION RT RTV White -60 to 204 C Non-corrosive, silicone adhesive EP Epoxy Black -55 to 150 C Low density syntactic foam epoxy encapsulant Page 1 of 3 HT9-3-F2-2525 Performance Curves at Th =25C THERMO ELECTRIC Page 2 of 3